Abstract
Solid State mass memory systems with memory capacities up to 1 Terabit pose formidable packaging challenges. There are thousands of components to be assembled and, for Aerospace applications where the system is aboard an airplane or satellite, the equipment has to be very light and occupy the smallest volume possible. Existing applications use Magnetic Recorders for mass storage. The weight and volume occupied by these solutions limit the amount of memory available on-board. System designers are therefore very limited in their possibilities for making full use of the data gathering/processing potential of satellites and airplanes. MCM technology has the potential to meet these objectives.
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References
C. Val and M. Leroy, (1991) The 3D interconnection — applications for mass memories and microprocessors, ISHM’ 91 Proceedings, 62–67.
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© 1995 Springer Science+Business Media Dordrecht
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Coello-Vera, A., Oudart, P., D’Andrea, P., Cysarek, G. (1995). High Performance Solid State Mass Memory Modules. In: Jones, W.K., Kurzweil, K., HarsĂ¡nyi, G., Mergui, S. (eds) MCM C/Mixed Technologies and Thick Film Sensors. NATO ASI Series, vol 2. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-0079-3_14
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DOI: https://doi.org/10.1007/978-94-011-0079-3_14
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-010-4039-6
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