Abstract
The fatigue resistance of the interface between electroless–nickel and the eutectic tin–lead solder alloy was examined in the as-reflowed and aged conditions and compared to fatigue behavior of the copper/solder interface under the same conditions. In the as-reflowed state, the fatigue resistance of the solder/electroless-nickel interface was slightly superior to that of the solder/copper interface. However, after long-term aging, the fatigue resistance of the solder/electroless-nickel interface became far worse in the high crack growth rate regime. Examinations of interfacial microstructures and crack growth mechanisms indicated that the differences in fatigue resistance between the two interfaces were not directly related to the thickness of the intermetallic phase at the interface, as commonly believed, but were due to differences in crack growth mechanisms.
Similar content being viewed by others
References
J.H. Lau, Ball Grid Array (McGraw-Hill Press, New York, 1995).
D.W. Baudrand, in ASM Handbook, Volume 5, Surface Engineering, (ASM International, Materials Park, OH, 1994), p. 290.
S.V.S. Tyagi, V.K. Tandon, and S. Ray, Z. Metallkde. 76, 492 (1985).
Y.Z. Zhang, Y.Y. Wu, and M. Yao, J. Mater. Sci. Lett. 17, 37 (1998).
B.G. Bagley and D. Turnbull, Acta Metall. 18, 857 (1970).
K.L. Lin and P.J. Lai, J. Electrochem. Soc. 136, 3803 (1989).
E.V. Makhsoos, E.L. Thomas and L.E. Toth, Metall. Trans. A 9A, 1449 (1978).
R.C. Agarwala and S. Ray, Z. Metallkde. 79, 472 (1988).
R.C. Agarwala and S. Ray, Z. Metallkde. 83, 199 (1992).
P. Albert, Z. Kovac, H. Lilienthal, T. McGuire, and Y. Nakamura, J. Appl. Phys. 38, 1258 (1967).
R.N. Duncan, in Proc. EN ’93 conference (Gardner Publications, Orlando, FL, 1993), p. 2.
K.L. Lin and J.M. Jang, Mater. Chem. Phys. 38, 33 (1994).
M. Inaba, K. Yamakawa, and N. Iwase, IEEE Trans. Comp. Hybrids, Manuf. Technol. CHMT-13, 119 (1990).
S.K. Kang and V. Ramachandran, Scr. Metall. 14, 421–24 (1980).
C.Y. Lee and K.L. Lin, Thin Solid Films 249, 201 (1994).
W.J. Tomlinson and H.G. Rhodes, J. Mater. Sci. 22, 1769 (1987).
K.L. Lin and C.J. Chen, J. Mater. Sci., Mater. Electron. 7, 397 (1999).
K.L. Lin and J.T. Chang, Scr. Metall. 30, 559 (1994).
C.Y. Lee and K.L. Lin, Thin Solid Films 229, 63 (1993).
J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys. 85, 8456 (1999).
D. Olsen, R. Wright, and H. Berg, in Proc. 13th Am. Reliability Phys. Symp. (Vicks Lithograph, Las Vegas, NV, 1975), p. 80.
H.N. Keller, IEEE Trans. Comp. Hybrids, Manuf. Technol. CHMT-9, 433–39 (1986).
D.R. Frear, F.M. Hosking, and P.T. Vianco, in Materials Developments in Microelectronic Packaging Conf. Proceedings (Montreal, Quebec, Canada, 1991), p. 229.
D.B. Bogy, J. Appl. Mech. 35, 460 (1968).
D.B. Bogy, Int. J. Solids Struct. 6, 1287 (1970).
D. Munz and Y.Y. Yang, J. Appl. Mech. 59, 857 (1992).
J.R. Rice, J. Appl. Mech. 55, 98 (1988).
J.W. Hutchinson and Z. Suo, in Advances in Applied Mechanics, edited by J.W. Hutchinson and E.M. Wu (Academic Press, San Diego, CA, 1992), Vol. 29, p. 64.
M.D. Thouless, Acta Mater. 38, 1135 (1990).
Z. Zhang and J.K. Shang, Metall. Mater. Trans. A 27A, 205 (1996).
P.L. Liu, Z. Xu, and J.K. Shang, Metall. Mater. Trans. A (2000, in press).
D. Yao and J.K. Shang, Metall. Mater. Trans. A 26A, 2677 (1995).
D. Frear, D. Grivas, and J.W. Morris, Jr., J. Electron. Mater. 16, 181 (1987).
P.T. Vianco, P.F. Hlava, and A.C. Kilgo, J. Electron. Mater. 23, 583 (1994).
P.T. Vianco, K.L. Erickson, and P.L. Hopkins, J. Electron. Mater. 23, 721 (1994).
D.R. Frear and P.T. Vianco, Metall. Mater. Trans. A 25A, 1509 (1994).
C.H. Raeder, L.E. Felton, V.A. Tanzi, and D.B. Knorr, J. Electron. Mater. 23, 611 (1994).
P.L. Liu and J.K. Shang (unpublished research).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Liu, P.L., Shang, J.K. A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces. Journal of Materials Research 15, 2347–2355 (2000). https://doi.org/10.1557/JMR.2000.0338
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.2000.0338