Abstract
The anisotropy of Sn crystal structures greatly affects the electromigration (EM) and thermomechanical fatigue (TMF) of solder joints. The size of solder joint shrinkage in electronic systems further makes EM and TMF an inseparably coupled issue. To obtain a better understanding of failure under combined moderately high (2000 A/cm2) current density and 10–150°C/1 h thermal cycling, analysis of separate, sequential, and concurrent EM and thermal cycling (TC) was imposed on single shear lap joints, and the microstructure and crystal orientations were incrementally characterized using electron backscatter diffraction (EBSD) mapping. First, it was determined that EM did not significantly change the crystal orientation, but the formation of Cu6Sn5 depended on the crystal orientation, and this degraded subsequent TMF behavior. Secondly, TC causes changes in crystal orientation. Concurrent EM and TC led to significant changes in crystal orientation by discontinuous recrystallization, which is facilitated by Cu6Sn5 particle formation. The newly formed Cu6Sn5 often showed its c-axis close to the direction of electron flow.
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Acknowledgements
The authors recognize the support of the Beijing Natural Science Foundation (2172006), the Beijing Nova Program (Z161100004916155), and the General Project of Science and Technology of Beijing Municipal Education Commission (SQKM2016100 05024).
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Zuo, Y., Bieler, T.R., Zhou, Q. et al. Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints. J. Electron. Mater. 47, 1881–1895 (2018). https://doi.org/10.1007/s11664-017-5980-0
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DOI: https://doi.org/10.1007/s11664-017-5980-0