Abstract
The effects of isothermal aging on the microstructure and mechanical behavior of Sn-Bi/Cu solder joints are reported. Lap shear solder joints of eutectic Sn-Bi solder were aged for 3 to 30 days at 80°C and then loaded to failure in shear. Changes in the joint microstructure including interphase coarsening, intermetallic growth, and evolution of the intermetallic/solder interface are documented. The aging experiments reveal the segregation of the Bi-rich phase of the solder to the intermetallic/solder interface. The ultimate shear strength and ductility of the joints are reported at strain rates of 4.0 × 10−1 to 4.0 × 10−5 S−1 for 3 and 30 days aging. The strength of the joints decreases with strain rate for both aging conditions; the ductility is low and independent of strain rate for the joints aged three days and increases considerably with reduced strain rate for joints, aged 30 days. Fractographs and cross sections of the failed joints detail the effect of aging on the fracture mechanism.
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Raeder, C.H., Felton, L.E., Tanzi, V.A. et al. The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints. J. Electron. Mater. 23, 611–617 (1994). https://doi.org/10.1007/BF02653346
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DOI: https://doi.org/10.1007/BF02653346