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Effect of loading type on fatigue crack growth behavior of solder joint in electronic packaging

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Abstract

Fatigue cracking tests of a solder joint were carried out using in-situ scanning electron microscopy (SEM) technology under tensile and bending cyclic loadings. The method for predicting the fatigue life is provided based on the fatigue crack growth rate of the solder joint. The results show that the effect of the loading type on the fatigue crack growth behavior of a solder joint cannot be ignored. In addition, the finite element analysis results help quantitatively estimate the response relationship between solder joint structures. The fatigue crack initiation life of a solder joint is in good agreement with the fatigue life (N50%) of a totally electronic board with 36 solder joints.

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Author information

Authors and Affiliations

  1. Department of Engineering Mechanics, AML, Tsinghua University, 100084, Beijing, China

    Xishu Wang, Huaihui Ren & Su Ja

  2. China Longyuan Power Group Corporation Limited, China Goudian, 100034, Beijing, China

    Huaihui Ren

  3. CSIRO Earth Science and Resource Engineering, 3168, VIC, Clayton, Australia

    Bisheng Wu

  4. Department of Mechanical System Engineering, Daiichi Institute of Technology, 899-4395, Kagoshima, Japan

    Norio Kawagoishi

Authors
  1. Xishu Wang
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  2. Huaihui Ren
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  3. Bisheng Wu
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  4. Su Ja
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  5. Norio Kawagoishi
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Corresponding author

Correspondence to Xishu Wang.

Additional information

The authors would like to thank the projects (Nos. 11072124 and 11272173) supported by NSFC, National Basic Research Program of China (No. 2010CB631006) and by State Key Lab of Advanced Metals and Materials (No. 2010ZD-04).

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Wang, X., Ren, H., Wu, B. et al. Effect of loading type on fatigue crack growth behavior of solder joint in electronic packaging. Acta Mech. Solida Sin. 27, 245–258 (2014). https://doi.org/10.1016/S0894-9166(14)60034-3

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  • DOI: https://doi.org/10.1016/S0894-9166(14)60034-3

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