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Dynamic recrystallization behavior and microstructure evolution of high-performance Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P during hot compression

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Abstract

By means of isothermal compression at temperatures in the range of 650–900 °C and strain rates in the range of 0.001–1 s−1, the dynamic recrystallization behavior and microstructural evolution of a Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P (wt%) alloy designed by a machine learning method were investigated. A semiempirical constitutive equation, processing maps and an average activation energy were generated. The microstructure under different conditions and the effect of strain rate on the texture of the alloy at 800–900 °C were observed. The results show that the suitable temperature is 800–900 °C; when the strain is less than 0.4, the appropriate strain rate is 0.01–0.5 s−1; and when the strain is greater than 0.4, the appropriate strain rate is below 0.05 s−1. After deformation at 800 °C, the main texture changed from {112}〈111〉 of copper to a uniform distribution with the increase in strain rate, but the sample did not have obvious texture after deformation at 850 and 900 °C. The above results can provide a reference for the selection of process parameters.

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Acknowledgments

This study was financially supported by the National Key Research and Development Program of China (No. 2016YFB0301300) and the National Natural Science Foundation of China (Nos. 51974028 and U1602271).

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Authors and Affiliations

  1. Beijing Advanced Innovation Center for Materials Genome Engineering, Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China

    Chang-Sheng Wang, Hua-Dong Fu & Jian-Xin Xie

  2. Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, Institute for Advanced Materials and Technology, Beijing, 100083, China

    Chang-Sheng Wang, Hua-Dong Fu & Jian-Xin Xie

Authors
  1. Chang-Sheng Wang
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  2. Hua-Dong Fu
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Correspondence to Jian-Xin Xie.

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Wang, CS., Fu, HD. & Xie, JX. Dynamic recrystallization behavior and microstructure evolution of high-performance Cu–3.28Ni–0.6Si–0.22Zn–0.11Cr–0.04P during hot compression. Rare Met. 40, 156–167 (2021). https://doi.org/10.1007/s12598-020-01578-z

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  • DOI: https://doi.org/10.1007/s12598-020-01578-z

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