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Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites

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Abstract

To fabricate electronic packaging shell of copper-matrix composite with characteristics of high thermal conductivity and low thermal expansion coefficient, semisolid forming technology, and powder metallurgy was combined. Conventional mechanical mixing of Cu and SiC could have insufficient wettability, and a new method of semisolid processing was introduced for billets preparation. The SiC/Cu composites were first prepared by PM, and then, semisolid reheating was performed for the successive semisolid forging. Composite billets with SiC 35 % volume fraction were compacted and sintered pressurelessly, microstructure analysis showed that the composites prepared by PM had high density, and the combination between SiC particles and Cu-alloy was good. Semisolid reheating was the crucial factor in determining the microstructure and thixotropic property of the billet. An optimised reheating strategy was proposed: temperature 1,025 °C and holding time 5 min.

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Acknowledgments

This study was financially supported by the National Natural Science Foundation of China (No. 51174028) and the Beijing Natural Science Foundation (No. 2102029).

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Kai-Kun Wang

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  1. Kai-Kun Wang
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Correspondence to Kai-Kun Wang.

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Wang, KK. Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites. Rare Met. 32, 191–195 (2013). https://doi.org/10.1007/s12598-013-0027-z

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  • DOI: https://doi.org/10.1007/s12598-013-0027-z

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