1. Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle

   • Bernd Michel
   • Jörg Bagdahn

   Foreword 17 March 2006 Pages: 377 - 377

2. Surface plasma treatments enabling low temperature direct bonding

   • Hubert Moriceau
   • François Rieutord
   • Anne Marie Charvet

   Technical paper 13 October 2005 Pages: 378 - 382

   

3. Effect of interfacial SiO₂ thickness for low temperature O₂ plasma activated wafer bonding

   • Benoit Olbrechts
   • Xuanxiong Zhang
   • Jean-Pierre Raskin

   Technical paper 07 September 2005 Pages: 383 - 390

   

4. Direct bonding with on-wafer metal interconnections

   • C. Jia
   • M. Wiemer
   • T. Gessner

   Technical paper 11 October 2005 Pages: 391 - 396

   

5. Wafer direct bonding with ambient pressure plasma activation

   • Markus Gabriel
   • Brad Johnson
   • Marko Eichler

   Technical paper 03 March 2006 Pages: 397 - 400

   

6. Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)

   • H. Luoto
   • T. Suni
   • H. Kattelus

   Technical paper 29 October 2005 Pages: 401 - 405

   

7. Bonded thick film SOI with pre-etched cavities

   • Tommi Suni
   • Kimmo Henttinen
   • Risto Mutikainen

   Technical paper 17 January 2006 Pages: 406 - 412

   

8. Discussion of tooling solutions for the direct bonding of silicon wafers

   • Nick Aitken
   • Tony Rogers

   Technical paper 14 January 2006 Pages: 413 - 417

   

9. Versatile low temperature wafer bonding and bond strength measurement by a blister test method

   • Alexander Doll
   • Martin Rabold
   • Peter Woias

   Technical paper 07 October 2005 Pages: 418 - 429

   

10. Influence of the frequency on fatigue of directly wafer-bonded silicon

    • Jörg Bagdahn
    • Michael Bernasch
    • Matthias Petzold

    Technical paper 08 September 2005 Pages: 430 - 435

    

11. Fabrication of microfluidic networks with integrated electrodes

    • D. C. Hermes
    • T. Heuser
    • A. van den Berg

    Technical paper 11 October 2005 Pages: 436 - 440

    

12. Anodic bonding of glass to aluminium

    • K. Schjølberg-Henriksen
    • E. Poppe
    • H. Jakobsen

    Technical paper 21 September 2005 Pages: 441 - 449

    

13. Fabrication and mechanical testing of glass chips for high-pressure synthetic or analytical chemistry

    • R. E. Oosterbroek
    • D. C. Hermes
    • A. van den. Berg

    Technical paper 07 September 2005 Pages: 450 - 454

    

14. Transfer of small structures by bonding

    • G. Villanueva
    • J.A. Plaza
    • J. Bausells

    Technical paper 11 October 2005 Pages: 455 - 461

    

15. A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers

    • R. Knechtel
    • M. Knaup
    • J. Bagdahn

    Technical paper 21 October 2005 Pages: 462 - 467

    

16. Wafer level encapsulation of microsystems using glass frit bonding

    • R. Knechtel
    • M. Wiemer
    • J. Frömel

    Technical paper 22 October 2005 Pages: 468 - 472

    

17. Mechanical properties of glass frit bonded micro packages

    • C. Dresbach
    • A. Krombholz
    • J. Bagdahn

    Technical paper 28 October 2005 Pages: 473 - 480

    

18. Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

    • J. Frömel
    • D. Billep
    • M. Wiemer

    Technical paper 18 October 2005 Pages: 481 - 483