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Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

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Abstract

This paper describes the application of a new method to verify the pressure and sealing of cavities in micromechanical components. The new method makes it possible to measure the pressure and the sealing (through measuring the pressure over time) of smallest gasvolumes with the monitoring of the quality factor of integrated micromechanical resonant structures. An example is used that shows the complete process of fabricating such micro mechanical resonant structures to evaluate a bonded structure.

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Authors and Affiliations

  1. Fraunhofer IZM Chemnitz, Reichenhainer Straße 88, 09126, Chemnitz, Germany

    J. Frömel & M. Wiemer

  2. TU-Chemnitz, Chemnitz, Germany

    D. Billep & T. Geßner

Authors
  1. J. Frömel
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  2. D. Billep
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  3. T. Geßner
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  4. M. Wiemer
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Correspondence to J. Frömel.

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Frömel, J., Billep, D., Geßner, T. et al. Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Microsyst Technol 12, 481–483 (2006). https://doi.org/10.1007/s00542-005-0032-8

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  • DOI: https://doi.org/10.1007/s00542-005-0032-8

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