Volume 43, Issue 12

Special Sections from the 2014 TMS Annual Meeting: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang