Abstract
CuantumFuse nano copper material has been used to assemble functional LED test boards and a small camera board with a 48 pad CMOS sensor quad-flat no-lead chip and a 10 in flexible electronics demo. Drop-in replacement of solder, by use of stencil printing and standard surface mount technology equipment, has been demonstrated. Applications in space and commercial systems are currently under consideration. The stable copper-nanoparticle paste has been examined and characterized by scanning electron microscopy and high-resolution transmission electron microscopy; this has shown that the joints are nanocrystalline but with substantial porosity. Assessment of reliability is expected to be complicated by this and by the effects of thermal and strain-enhanced coarsening of pores. Strength, creep, and fatigue properties were measured and results are discussed with reference to our understanding of solder reliability to assess the potential of this nano-copper based solder alternative.
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Acknowledgements
This work was supported by the Integrated Electronics Engineering Center (IEEC) at Binghamton University.
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Schnabl, K., Wentlent, L., Mootoo, K. et al. Nanocopper Based Solder-Free Electronic Assembly. J. Electron. Mater. 43, 4515–4521 (2014). https://doi.org/10.1007/s11664-014-3478-6
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DOI: https://doi.org/10.1007/s11664-014-3478-6