1. Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies

   News 25 September 2010 Pages: 2503 - 2503

2. Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

   • Young Min Kim
   • Hee-Ra Roh
   • Young-Ho Kim

   OriginalPaper 23 September 2010 Pages: 2504 - 2512

3. Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane

   • Ruihong Zhang
   • Guangchen Xu
   • K. N. Subramanian

   OriginalPaper 24 September 2010 Pages: 2513 - 2521

4. Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

   • Chien-Fu Tseng
   • Kai-Jheng Wang
   • Jenq-Gong Duh

   OriginalPaper 22 September 2010 Pages: 2522 - 2527

5. Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

   • M. Y. Tsai
   • Y. L. Lin
   • C. R. Kao

   OriginalPaper 22 September 2010 Pages: 2528 - 2535

6. Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests

   • Ning Zhang
   • Yaowu Shi
   • Fuqian Yang

   OriginalPaper 17 September 2010 Pages: 2536 - 2543

7. Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures

   • Chi-Yang Yu
   • Tae-Kyu Lee
   • Jenq-Gong Duh

   OriginalPaper 14 September 2010 Pages: 2544 - 2552

8. Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni

   • Petr Harcuba
   • Miloš Janeček

   OriginalPaper 14 September 2010 Pages: 2553 - 2557

9. Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C

   • Kai-Jheng Wang
   • Jenq-Gong Duh
   • Dirk Schade

   OriginalPaper 14 September 2010 Pages: 2558 - 2563

10. Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects

    • Tae-Kyu Lee
    • Hongtao Ma
    • Jie Xue

    OriginalPaper 09 September 2010 Pages: 2564 - 2573

11. Formation and Growth of Intermetallic Compound Cu₆Sn₅ at Early Stages in Lead-Free Soldering

    • M.S. Park
    • R. Arroyave

    OriginalPaper Open access 10 September 2010 Pages: 2574 - 2582

12. Discussion on the Mechanism of Electromigration from the Perspective of Electromagnetism

    • Peng Zhou
    • William C. Johnson

    OriginalPaper Open access 10 September 2010 Pages: 2583 - 2587

13. Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

    • Tae-Kyu Lee
    • Bite Zhou
    • Thomas R. Bieler

    OriginalPaper 10 September 2010 Pages: 2588 - 2597

14. Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

    • Hitoshi Sakurai
    • Alongheng Baated
    • Katsuaki Suganuma

    OriginalPaper 09 September 2010 Pages: 2598 - 2604

15. Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes

    • K. N. Chen
    • Y. Zhu
    • R. Reif

    OriginalPaper 04 September 2010 Pages: 2605 - 2610

16. Effect of DC Current on the Creep Deformation of Tin

    • Rong Chen
    • Fuqian Yang

    OriginalPaper 04 September 2010 Pages: 2611 - 2617

17. Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material

    • Chia-Ju Chen
    • Chih-Ming Chen
    • Jhih-Sin Hong

    OriginalPaper Open access 02 September 2010 Pages: 2618 - 2626

18. Microstructural Variation and Phase Evolution in the Reaction of Sn-xAg-Cu Solders and Cu-yZn Substrates During Reflow

    • Chi-Yang Yu
    • Jenq-Gong Duh

    OriginalPaper 01 September 2010 Pages: 2627 - 2635

19. Effects of Ni Additions on the Growth of Cu₃Sn in High-Lead Solders

    • Y. W. Wang
    • C. C. Chang
    • C. R. Kao

    OriginalPaper 15 July 2010 Pages: 2636 - 2642

20. Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

    • Jaewon Chang
    • Sun-Kyoung Seo
    • Hyuck Mo Lee

    OriginalPaper 07 July 2010 Pages: 2643 - 2652

21. Critical Current Density for Inhibiting (Cu,Ni)₆Sn₅ Formation on the Ni Side of Cu/Solder/Ni Joints

    • W. H. Wu
    • H. L. Chung
    • C. E. Ho

    OriginalPaper 17 June 2010 Pages: 2653 - 2661

22. Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer

    • C.C. Chang
    • H.Y. Chung
    • C.R. Kao

    OriginalPaper 02 June 2010 Pages: 2662 - 2668

23. Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

    • Bite Zhou
    • Thomas R. Bieler
    • Kuo-Chuan Liu

    OriginalPaper 29 September 2010 Pages: 2669 - 2679

24. Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl₄-Na₂SO₃ Electroplating Solutions for Pb-Free Solder Packaging

    • Neda Dalili
    • Anqiang He
    • Douglas G. Ivey

    Erratum 19 October 2010 Pages: 2680 - 2680

25. Investigation of Trap States in AlInN/AlN/GaN Heterostructures by Frequency-Dependent Admittance Analysis

    • Engin Arslan
    • Serkan Bütün
    • Ekmel Ozbay

    OriginalPaper 17 September 2010 Pages: 2681 - 2686

26. Morphological Stability of Diffusion Couples Under Electric Current

    • Perry Leo
    • Ana Rasetti

    OriginalPaper Open access 14 September 2010 Pages: 2687 - 2695

27. Empirical Study of Hall Bars on Few-Layer Graphene on C-Face 4H-SiC

    • M. L. Bolen
    • T. Shen
    • M. A. Capano

    OriginalPaper 14 September 2010 Pages: 2696 - 2701

28. Magnetic Silver-Coated Ferrite Nanoparticles and Their Application in Thick Films

    • Jianguo Liu
    • Baling Huang
    • Xiaoyan Zeng

    OriginalPaper 14 September 2010 Pages: 2702 - 2710

29. A New Nonlinear Optically Active Donor–Acceptor-Type Conjugated Polymer: Synthesis and Electrochemical and Optical Characterization

    • M. G. Manjunatha
    • A. V. Adhikari
    • Reji Philip

    OriginalPaper 30 September 2010 Pages: 2711 - 2719

30. Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

    • H. R. Kotadia
    • O. Mokhtari
    • S. H. Mannan

    OriginalPaper 01 October 2010 Pages: 2720 - 2731