1. Foreword

   • Sinn-wen Chen
   • Srinivas Chada
   • Katsuaki Suganuma

   EditorialNotes 08 October 2008 Pages: 1 - 1

2. Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

   • I. Ohnuma
   • T. Saegusa
   • K. Ishida

   OriginalPaper Open access 10 September 2008 Pages: 2 - 9

3. Cu-Ni-Sn: A Key System for Lead-Free Soldering

   • C. Schmetterer
   • H. Flandorfer
   • H. Ipser

   OriginalPaper 08 August 2008 Pages: 10 - 24

4. Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder

   • S.C. Yang
   • W.C. Chang
   • C.R. Kao

   OriginalPaper 10 September 2008 Pages: 25 - 32

5. Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character

   • S. Terashima
   • T. Kohno
   • K. Tatsumi

   OriginalPaper 08 October 2008 Pages: 33 - 38

6. Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

   • Dong Hoon Kim
   • Moon Gi Cho
   • Hyuck Mo Lee

   OriginalPaper 08 August 2008 Pages: 39 - 45

7. Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate

   • Bo-In Noh
   • Seung-Boo Jung

   OriginalPaper 17 September 2008 Pages: 46 - 53

8. Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate

   • Yoshikazu Takaku
   • Komei Makino
   • Kiyohito Ishida

   OriginalPaper 22 August 2008 Pages: 54 - 60

9. Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow

   • Chih-hao Chen
   • Chi-pu Lin
   • Chih-ming Chen

   OriginalPaper 08 October 2008 Pages: 61 - 69

10. Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density

    • Sang-Su Ha
    • Jong-Woong Kim
    • Seung-Boo Jung

    OriginalPaper 21 October 2008 Pages: 70 - 77

11. Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

    • Aditya Kumar
    • Ying Yang
    • Zhong Chen

    OriginalPaper 01 November 2008 Pages: 78 - 87

12. Suppressing Growth of the Cu₅Zn₈ Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints

    • R. S. Lai
    • K. L. Lin
    • B. Salam

    OriginalPaper 21 October 2008 Pages: 88 - 92

13. Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates

    • Yee-Wen Yen
    • Wei-Kai Liou
    • Chiapyng Lee

    OriginalPaper 21 October 2008 Pages: 93 - 99

14. Thermal Stability Study of Cu(MoN _x ) Seed Layer on Barrierless Si

    • J.P. Chu
    • C.H. Lin
    • V.S. John

    OriginalPaper 29 July 2008 Pages: 100 - 107

15. Reflectivity and Abnormal Absorption at ITO/Al Interface

    • Y.H. Lin
    • C.Y. Liu

    OriginalPaper 21 October 2008 Pages: 108 - 112

16. Phase Transitions in the BiVO₄-nPbO (n = 1, 2) System: Structural–Electrical Properties Relationships

    • Jean-Pierre Wignacourt
    • Michel Drache
    • Pascal Roussel

    OriginalPaper 06 November 2008 Pages: 113 - 118

17. Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy

    • W. Wang
    • W. Bowen
    • J. Phillips

    OriginalPaper 21 October 2008 Pages: 119 - 125

18. Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe

    • Derek S. Bale
    • Csaba Szeles

    OriginalPaper 10 October 2008 Pages: 126 - 144

19. Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process

    • Chung-Chieh Yang
    • Chia-Feng Lin
    • Chung-Ying Chang

    OriginalPaper 30 October 2008 Pages: 145 - 152

20. Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al _x Ga_1−x N with High Aluminum Mole Fraction

    • E.A. Moore
    • Y.K. Yeo
    • R.L. Hengehold

    OriginalPaper 08 October 2008 Pages: 153 - 158

21. A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst

    • Akihisa Kubota
    • Keita Yagi
    • Kazuto Yamauchi

    OriginalPaper 16 October 2008 Pages: 159 - 163

22. Ceramic Substrates for High-temperature Electronic Integration

    • N. Chasserio
    • S. Guillemet-Fritsch
    • S. Dagdag

    OriginalPaper 07 October 2008 Pages: 164 - 174

23. Factors That Govern the Performance of Thermal Interface Materials

    • Parisa Pour Shahid Saeed Abadi
    • Chia-Ken Leong
    • D.D.L. Chung

    OriginalPaper 10 October 2008 Pages: 175 - 192

24. Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source

    • Chih-ming Chen
    • Po-yuan Shih
    • Yi-wei Lin

    OriginalPaper 09 October 2008 Pages: 193 - 199

25. A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu

    • Li-ling Yan
    • Cheng-kuo Lee
    • Seung-Uk Yoon

    OriginalPaper 16 October 2008 Pages: 200 - 207

26. Simulation, Modeling, and Crystal Growth of Cd_0.9Zn_0.1Te for Nuclear Spectrometers

    • Krishna C. Mandal
    • Sung Hoon Kang
    • Joseph A. Williams

    Erratum 07 October 2008 Pages: 208 - 208