Foreword Chih-ming ChenSrinivas ChadaChao-hong Wang Acknowledgments 28 August 2009 Pages: 2211 - 2211
Copper-Silver Alloy for Advanced Barrierless Metallization C. H. LinW. K. Leau OriginalPaper 08 August 2009 Pages: 2212 - 2221
Interfacial Reactions of Sn-9Zn-xCu (x = 1, 4, 7, 10) Solders with Ni Substrates Wei-kai LiouYee-Wen YenChien-Chung Jao OriginalPaper 07 July 2009 Pages: 2222 - 2227
Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps Gi-Tae LimByoung-Joon KimYoung-Bae Park OriginalPaper 18 August 2009 Pages: 2228 - 2233
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates C. C. ChangY. W. LinC. R. Kao OriginalPaper 30 June 2009 Pages: 2234 - 2241
Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Moon Gi ChoSung K. KangHyuck Mo Lee OriginalPaper 30 June 2009 Pages: 2242 - 2250
Fifteen-Nanometer Ru Diffusion Barrier on NiSi/Si for a sub-45 nm Cu Contact Plug Jia-Huei LinJiing-Herng LeeJau-Shiung Fang OriginalPaper 11 August 2009 Pages: 2251 - 2256
Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions Yee-Wen YenH. W. TsengC. Y. Liu OriginalPaper 19 August 2009 Pages: 2257 - 2263
Enhancement in Conductivity and Transmittance of Zinc Oxide Prepared by Chemical Bath Deposition Wei-Hsiang LuoTing-Kan TsaiJau-Shiung Fang OriginalPaper 04 August 2009 Pages: 2264 - 2269
Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process Kuan-Chih HuangFuh-Sheng ShieuC. Y. Liu OriginalPaper 07 August 2009 Pages: 2270 - 2274
The Ni-rich Part of the Ni-P-Sn System: Isothermal Sections C. SchmettererJ. VizdalH. Ipser OriginalPaper 25 June 2009 Pages: 2275 - 2300
Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Inyu JungMoon Gi ChoHyuck Mo Lee OriginalPaper 26 June 2009 Pages: 2301 - 2307
In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays Albert T. WuChun-Yang TsaiChing-Shun Ku OriginalPaper 28 August 2009 Pages: 2308 - 2313
Investigation of the Interfaces in Ni-FUSI/Hf-Based/Si and Ni-FUSI/SiO2/Si Stacks by Physical and Electrical Characterization Techniques S. Y. Tan OriginalPaper 24 September 2009 Pages: 2314 - 2322
Controlled Growth of Non-Uniform Arsenic Profiles in Silicon Reduced-Pressure Chemical Vapor Deposition Epitaxial Layers M. PopadićT. L. M. ScholtesL. K. Nanver OriginalPaper Open access 31 July 2009 Pages: 2323 - 2328
Performance Comparison of Top- and Bottom-emitting Long Wave Infrared Light Emitting Diode Devices Naresh C. Das OriginalPaper 11 August 2009 Pages: 2329 - 2334
N Doping and Al-N Co-doping in Sol–Gel ZnO Films: Studies of Their Structural, Electrical, Optical, and Photoconductive Properties M. DuttaT. GhoshD. Basak OriginalPaper 11 August 2009 Pages: 2335 - 2342
Analysis of Dislocation Density in Pb(1−x)Sn x Se Grown on ZnTe/Si by MBE P. J. TaylorN. K. DharW. A. Jesser OriginalPaper 08 August 2009 Pages: 2343 - 2347
Ohmic Contact to High-Aluminum-Content AlGaN Epilayers Surendra SrivastavaSeong Mo HwangAsif Khan OriginalPaper 01 September 2009 Pages: 2348 - 2352
Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition Meng LiuAi-Ping Xian OriginalPaper 26 August 2009 Pages: 2353 - 2361
Impact of Reaction Shrinkage on Stress in Semiconductor Packages Manfred MengelJoachim Mahler OriginalPaper 29 July 2009 Pages: 2362 - 2367
Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller Yung-Chi ChengChin-Hao HsuMeng-Hui Li OriginalPaper 28 July 2009 Pages: 2368 - 2375
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction D. R. ShirleyJ. K. Spelt OriginalPaper Open access 16 September 2009 Pages: 2376 - 2387
Primary Creep in Sn-3.8Ag-0.7Cu Solder, Part II: Constitutive Creep Model Development and Finite Element Analysis D. R. ShirleyJ. K. Spelt OriginalPaper 16 September 2009 Pages: 2388 - 2397
Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints X. N. DuJ. D. GuoJ. K. Shang OriginalPaper 18 August 2009 Pages: 2398 - 2404
Wetting Behavior and Mechanical Properties of Sn-Zn and Sn-Pb Solder Alloys Leonardo R. GarciaWislei R. OsórioAmauri Garcia OriginalPaper 04 August 2009 Pages: 2405 - 2414
Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films Yunhui MeiXu ChenHong Gao OriginalPaper 04 August 2009 Pages: 2415 - 2426