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Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

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Abstract

The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu3Sn and Cu6Sn5 intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140°C, the thickness of the Cu6Sn5 IMC at the anode increased significantly. Sn3Sb2 IMC coarsened in the Cu6Sn5 IMC at the anode and in the β-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.

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Authors and Affiliations

  1. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    X. N. Du, J. D. Guo & J. K. Shang

  2. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA

    J. K. Shang

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  1. X. N. Du
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  2. J. D. Guo
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  3. J. K. Shang
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Correspondence to J. D. Guo.

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Du, X.N., Guo, J.D. & Shang, J.K. Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints. J. Electron. Mater. 38, 2398–2404 (2009). https://doi.org/10.1007/s11664-009-0917-x

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  • DOI: https://doi.org/10.1007/s11664-009-0917-x

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