1. Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique

   • P. Cusumano
   • S. Gambino

   OriginalPaper 21 November 2007 Pages: 231 - 239

2. Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator

   • Leonardo Gomez
   • Michael Canonico
   • Judy L. Hoyt

   OriginalPaper 13 November 2007 Pages: 240 - 244

3. Silicidation of Ni(Yb) Film on Si(001)

   • Jia Luo
   • Yu-Long Jiang
   • Paul K. Chu

   OriginalPaper 16 November 2007 Pages: 245 - 248

4. Stress-Induced Grain Boundary Migration in Polycrystalline Copper

   • Max O. Bloomfield
   • Daniel N. Bentz
   • Timothy S. Cale

   OriginalPaper 11 December 2007 Pages: 249 - 263

5. Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems

   • Vincent Grolier
   • Rainer Schmid-Fetzer

   OriginalPaper 30 November 2007 Pages: 264 - 278

6. Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification

   • F. Gao
   • C.P. Wang
   • K. Ishida

   OriginalPaper 21 December 2007 Pages: 279 - 287

7. Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu

   • M. He
   • V.L. Acoff

   OriginalPaper 28 December 2007 Pages: 288 - 299

8. Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints

   • Min He
   • Sylvester N. Ekpenuma
   • Viola L. Acoff

   OriginalPaper 28 December 2007 Pages: 300 - 306

9. Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability

   • Xiaoqin Lin
   • Le Luo

   OriginalPaper 19 December 2007 Pages: 307 - 313

10. Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders

    • Yoshikazu Takaku
    • Lazuardi Felicia
    • Kiyohito Ishida

    OriginalPaper 20 November 2007 Pages: 314 - 323

11. Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag

    • Jung-Mo Kim
    • Jae-Pil Jung
    • Jong-Young Kim

    OriginalPaper 17 November 2007 Pages: 324 - 330

12. Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys

    • Min Pei
    • Jianmin Qu

    OriginalPaper 13 November 2007 Pages: 331 - 338

13. Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder

    • Yao Yao
    • Semyon Vaynman
    • Morris E. Fine

    OriginalPaper 08 December 2007 Pages: 339 - 346

14. Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

    • T. Chen
    • I. Dutta

    OriginalPaper 08 December 2007 Pages: 347 - 354

15. Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition

    • Jianhua Joshua Yang
    • C.-X. Ji
    • Y. A. Chang

    OriginalPaper 13 November 2007 Pages: 355 - 360

16. Wet Etching Study of La_0.67(Sr_0.5Ca_0.5)_0.33MnO₃ Films on Silicon Substrates

    • Joo-Hyung Kim
    • Alexander M. Grishin
    • Velislava Angelova Ignatova

    OriginalPaper 04 December 2007 Pages: 361 - 367

17. The Effect of Hydrogen on the Fracture Properties of 0.8(Na_1/2Bi_1/2)TiO₃-0.2(K_1/2Bi_1/2)TiO₃ Ferroelectric Ceramics

    • H. Zhang
    • Y.J. Su
    • Y.X. Li

    OriginalPaper 20 November 2007 Pages: 368 - 372