Space Charge and Carrier Trapping Effects on the Transient Photocurrents of Organic Materials Using the Time-of-Flight Technique P. CusumanoS. Gambino OriginalPaper 21 November 2007 Pages: 231 - 239
Fabrication of Strained-Si/Strained-Ge Heterostructures on Insulator Leonardo GomezMichael CanonicoJudy L. Hoyt OriginalPaper 13 November 2007 Pages: 240 - 244
Silicidation of Ni(Yb) Film on Si(001) Jia LuoYu-Long JiangPaul K. Chu OriginalPaper 16 November 2007 Pages: 245 - 248
Stress-Induced Grain Boundary Migration in Polycrystalline Copper Max O. BloomfieldDaniel N. BentzTimothy S. Cale OriginalPaper 11 December 2007 Pages: 249 - 263
Experimental Study of Au-Pt-Sn Phase Equilibria and Thermodynamic Assessment of the Au-Pt and Au-Pt-Sn Systems Vincent GrolierRainer Schmid-Fetzer OriginalPaper 30 November 2007 Pages: 264 - 278
Thermodynamic Assessment of Phase Equilibria in the Sn-Ag-Ni System with Key Experimental Verification F. GaoC.P. WangK. Ishida OriginalPaper 21 December 2007 Pages: 279 - 287
Effect of Bi on the Interfacial Reaction between Sn-3.7Ag-xBi Solders and Cu M. HeV.L. Acoff OriginalPaper 28 December 2007 Pages: 288 - 299
Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints Min HeSylvester N. EkpenumaViola L. Acoff OriginalPaper 28 December 2007 Pages: 300 - 306
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability Xiaoqin LinLe Luo OriginalPaper 19 December 2007 Pages: 307 - 313
Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders Yoshikazu TakakuLazuardi FeliciaKiyohito Ishida OriginalPaper 20 November 2007 Pages: 314 - 323
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag Jung-Mo KimJae-Pil JungJong-Young Kim OriginalPaper 17 November 2007 Pages: 324 - 330
Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys Min PeiJianmin Qu OriginalPaper 13 November 2007 Pages: 331 - 338
Energy-Based Micromechanics Analysis on Fatigue Crack Propagation Behavior in Sn-Ag Eutectic Solder Yao YaoSemyon VaynmanMorris E. Fine OriginalPaper 08 December 2007 Pages: 339 - 346
Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders T. ChenI. Dutta OriginalPaper 08 December 2007 Pages: 347 - 354
Epitaxial Growth and Surface Roughness Control of Ferromagnetic Thin Films on Si by Sputter Deposition Jianhua Joshua YangC.-X. JiY. A. Chang OriginalPaper 13 November 2007 Pages: 355 - 360
Wet Etching Study of La0.67(Sr0.5Ca0.5)0.33MnO3 Films on Silicon Substrates Joo-Hyung KimAlexander M. GrishinVelislava Angelova Ignatova OriginalPaper 04 December 2007 Pages: 361 - 367
The Effect of Hydrogen on the Fracture Properties of 0.8(Na1/2Bi1/2)TiO3-0.2(K1/2Bi1/2)TiO3 Ferroelectric Ceramics H. ZhangY.J. SuY.X. Li OriginalPaper 20 November 2007 Pages: 368 - 372