1. Fabrication and Properties of an Asymmetric Waveguide Containing Nanoparticles

   • J.L. Zhang
   • T.F. Kuech

   OriginalPaper 02 November 2007 Pages: 135 - 144

2. Preparation and Characterization of CdTe for Solar Cells, Detectors, and Related Thin-Film Materials

   • Nazar Abbas Shah
   • Abid Ali
   • Asghari Maqsood

   OriginalPaper 08 November 2007 Pages: 145 - 151

3. Helium-Plasma-Prepared (111)A HgCdTe and (211)B InSb

   • Michael Martinka
   • Marvin Jaime-Vasquez
   • J.K. Markunas

   OriginalPaper 16 October 2007 Pages: 152 - 156

4. Electrical Switching in TlSbSe₂ Chalcogenide Semiconductors

   • N. Kalkan
   • S. Yildirim
   • D. Deger

   OriginalPaper 25 October 2007 Pages: 157 - 160

5. Ir Diffusion Barriers in Ni/Au Ohmic Contacts to p-Type CuCrO₂

   • W.T. Lim
   • P.W. Sadik
   • F. Ren

   OriginalPaper 07 November 2007 Pages: 161 - 166

6. Investigation of Laser-Assisted Microcrystalline SiGe Films Deposited at Low Temperature

   • Li-Wen Lai
   • Hsin-Ying Lee
   • Ching-Ting Lee

   OriginalPaper 18 October 2007 Pages: 167 - 171

7. Density Functional Theory Modeling of (001)Si–Oxynitride Interfaces

   • Athanasios Stefanou

   OriginalPaper 06 November 2007 Pages: 172 - 175

8. Synthesis of Silicon Nanoneedles

   • Y.W. Chen
   • S.H. Jiang
   • R.C. Wang

   BriefCommunication 09 October 2007 Pages: 176 - 179

9. Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer

   • Dongmei Li
   • Qiang Li
   • F. Pan

   OriginalPaper 30 October 2007 Pages: 180 - 184

10. Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

    • J.W. Jang
    • L.N. Ramanathan
    • D.R. Frear

    BriefCommunication 06 November 2007 Pages: 185 - 188

11. Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions

    • Xin Long
    • Indranath Dutta
    • Darrel R. Frear

    OriginalPaper 30 October 2007 Pages: 189 - 200

12. Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

    • Yi-Shao Lai
    • Jenn-Ming Song
    • Ying-Ta Chiu

    OriginalPaper 30 October 2007 Pages: 201 - 209

13. Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems

    • Xing Jun Liu
    • Feng Gao
    • Kiyohito Ishida

    OriginalPaper 25 October 2007 Pages: 210 - 217

14. Recent Observations on Tin Pest Formation in Solder Alloys

    • W.J. Plumbridge

    OriginalPaper 19 October 2007 Pages: 218 - 223

15. Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder

    • Hsiao-Yun Chen
    • Chih Chen
    • Karl Hensen

    OriginalPaper 16 October 2007 Pages: 224 - 230