Fabrication and Properties of an Asymmetric Waveguide Containing Nanoparticles J.L. ZhangT.F. Kuech OriginalPaper 02 November 2007 Pages: 135 - 144
Preparation and Characterization of CdTe for Solar Cells, Detectors, and Related Thin-Film Materials Nazar Abbas ShahAbid AliAsghari Maqsood OriginalPaper 08 November 2007 Pages: 145 - 151
Helium-Plasma-Prepared (111)A HgCdTe and (211)B InSb Michael MartinkaMarvin Jaime-VasquezJ.K. Markunas OriginalPaper 16 October 2007 Pages: 152 - 156
Electrical Switching in TlSbSe2 Chalcogenide Semiconductors N. KalkanS. YildirimD. Deger OriginalPaper 25 October 2007 Pages: 157 - 160
Ir Diffusion Barriers in Ni/Au Ohmic Contacts to p-Type CuCrO2 W.T. LimP.W. SadikF. Ren OriginalPaper 07 November 2007 Pages: 161 - 166
Investigation of Laser-Assisted Microcrystalline SiGe Films Deposited at Low Temperature Li-Wen LaiHsin-Ying Lee Ching-Ting Lee OriginalPaper 18 October 2007 Pages: 167 - 171
Density Functional Theory Modeling of (001)Si–Oxynitride Interfaces Athanasios Stefanou OriginalPaper 06 November 2007 Pages: 172 - 175
Synthesis of Silicon Nanoneedles Y.W. ChenS.H. JiangR.C. Wang BriefCommunication 09 October 2007 Pages: 176 - 179
Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer Dongmei LiQiang LiF. Pan OriginalPaper 30 October 2007 Pages: 180 - 184
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints J.W. JangL.N. RamanathanD.R. Frear BriefCommunication 06 November 2007 Pages: 185 - 188
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions Xin LongIndranath DuttaDarrel R. Frear OriginalPaper 30 October 2007 Pages: 189 - 200
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints Yi-Shao LaiJenn-Ming SongYing-Ta Chiu OriginalPaper 30 October 2007 Pages: 201 - 209
Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems Xing Jun LiuFeng GaoKiyohito Ishida OriginalPaper 25 October 2007 Pages: 210 - 217
Recent Observations on Tin Pest Formation in Solder Alloys W.J. Plumbridge OriginalPaper 19 October 2007 Pages: 218 - 223
Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder Hsiao-Yun ChenChih ChenKarl Hensen OriginalPaper 16 October 2007 Pages: 224 - 230
