1. Foreword

   • David P. Field
   • Christopher A. Michaluk
   • Jerzy A. Szpunar

   Special Issue Paper Pages: 1463 - 1463

2. Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

   • K. N. Chen
   • C. S. Tan
   • R. Reif

   Special Issue Paper Pages: 1464 - 1467

3. Influence of tungsten sputtering target density on physical vapor deposition thin film properties

   • Chi-Fung Lo
   • Peter McDonald
   • Paul Gilman

   Special Issue Paper Pages: 1468 - 1473

4. Measurement of angular emission trajectories for magnetron-sputtered tantalum

   • C. E. Wickersham Jr.
   • Zhiguo Zhang

   Special Issue Paper Pages: 1474 - 1479

5. Structure and soft magnetic properties of Fe-Co-Ni-based multicomponent thin films

   • Hung-Kai Chen
   • Shih-Hai Li
   • Jenq-Gong Duh

   Special Issue Paper Pages: 1480 - 1483

6. The effects of substrate bias, substrate temperature, and pulse frequency on the microstructures of chromium nitride coatings deposited by pulsed direct current reactive magnetron sputtering

   • Jyh-Wei Lee
   • Shih-Kang Tien
   • Yu-Chu Kuo

   Special Issue Paper Pages: 1484 - 1492

7. Annealing textures of copper damascene interconnects for ultra-large-scale integration

   • Hyo Jong Lee
   • Heung Nam Han
   • Dong Nyung Lee

   Special Issue Paper Pages: 1493 - 1499

8. Effect of film thickness on the evolution of annealing texture in sputtered copper films

   • N. -J. Park
   • D. P. Field
   • P. R. Besser

   Special Issue Paper Pages: 1500 - 1508

9. Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction

   • Kabirkumar J. Mirpuri
   • Jerzy A. Szpunar

   Special Issue Paper Pages: 1509 - 1520

10. Microstructural development in asymmetric processing of tantalum plate

    • D. P. Field
    • J. M. Yanke
    • C. A. Michaluk

    Special Issue Paper Pages: 1521 - 1525

11. Thermophysical properties of molten refractory metals measured by an electrostatic levitator

    • Takehiko Ishikawa
    • Paul-François Paradis

    Special Issue Paper Pages: 1526 - 1532

12. Microstructure evaluation and mechanical properties of nanolayered chromium nitride/tungsten nitride coating

    • Fan-Bean Wu
    • Shi-Kang Tien
    • Jyh-Wei Lee

    Special Issue Paper Pages: 1533 - 1537

13. Effects of process current density and temperature on electrochemical boriding of steel in molten salts

    • G. Kartal
    • S. Timur
    • C. Arslan

    Special Issue Paper Pages: 1538 - 1542

14. Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering

    • Kai-Zheng Wang
    • Chih-Ming Chen

    Regular Issue Paper Pages: 1543 - 1549

15. Evaluation of solder joint reliability in flip-chip packages during accelerated testing

    • Jong-Woong Kim
    • Dae-Gon Kim
    • Seung-Boo Jung

    Regular Issue Paper Pages: 1550 - 1557

16. The formation of epitaxial hexagonal boron nitride on nickel substrates

    • P. C. Yang
    • J. T. Prater
    • R. F. Davis

    Regular Issue Paper Pages: 1558 - 1564

17. Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process

    • Ja-Myeong Koo
    • Seung-Boo Jung

    Regular Issue Paper Pages: 1565 - 1572

18. Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: Enhancement of electrical and thermal properties

    • Yi Li
    • Kyoung-Sik Moon
    • C. P. Wong

    Regular Issue Paper Pages: 1573 - 1578

19. Whisker growth on surface treatment in the pure tin plating

    • Kyung-Seob Kim
    • Wan-Ok Han
    • Sung-Won Han

    Regular Issue Paper Pages: 1579 - 1585

20. Analytical equations for predicting the thermal properties of isotropic conductive adhesives

    • Masahiro Inoue
    • Takahiro Sugimura
    • Katsuaki Suganuma

    Regular Issue Paper Pages: 1586 - 1590

21. Formation of bulk Ag₃Sn intermetallic compounds in Sn-Ag lead-free solders in solidification

    • J. Shen
    • Y. C. Liu
    • Y. Q. Yang

    Regular Issue Paper Pages: 1591 - 1597

22. The effect of forming gas anneal on the oxygen content in bonded copper layer

    • C. S. Tan
    • K. N. Chen
    • R. Reif

    Regular Issue Paper Pages: 1598 - 1602