Foreword David P. FieldChristopher A. MichalukJerzy A. Szpunar Special Issue Paper Pages: 1463 - 1463
Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration K. N. ChenC. S. TanR. Reif Special Issue Paper Pages: 1464 - 1467
Influence of tungsten sputtering target density on physical vapor deposition thin film properties Chi-Fung LoPeter McDonaldPaul Gilman Special Issue Paper Pages: 1468 - 1473
Measurement of angular emission trajectories for magnetron-sputtered tantalum C. E. Wickersham Jr.Zhiguo Zhang Special Issue Paper Pages: 1474 - 1479
Structure and soft magnetic properties of Fe-Co-Ni-based multicomponent thin films Hung-Kai ChenShih-Hai LiJenq-Gong Duh Special Issue Paper Pages: 1480 - 1483
The effects of substrate bias, substrate temperature, and pulse frequency on the microstructures of chromium nitride coatings deposited by pulsed direct current reactive magnetron sputtering Jyh-Wei LeeShih-Kang TienYu-Chu Kuo Special Issue Paper Pages: 1484 - 1492
Annealing textures of copper damascene interconnects for ultra-large-scale integration Hyo Jong LeeHeung Nam HanDong Nyung Lee Special Issue Paper Pages: 1493 - 1499
Effect of film thickness on the evolution of annealing texture in sputtered copper films N. -J. ParkD. P. FieldP. R. Besser Special Issue Paper Pages: 1500 - 1508
Influence of substrate on high-temperature behavior of copper film studied in situ by electron backscatter diffraction Kabirkumar J. MirpuriJerzy A. Szpunar Special Issue Paper Pages: 1509 - 1520
Microstructural development in asymmetric processing of tantalum plate D. P. FieldJ. M. YankeC. A. Michaluk Special Issue Paper Pages: 1521 - 1525
Thermophysical properties of molten refractory metals measured by an electrostatic levitator Takehiko IshikawaPaul-François Paradis Special Issue Paper Pages: 1526 - 1532
Microstructure evaluation and mechanical properties of nanolayered chromium nitride/tungsten nitride coating Fan-Bean WuShi-Kang TienJyh-Wei Lee Special Issue Paper Pages: 1533 - 1537
Effects of process current density and temperature on electrochemical boriding of steel in molten salts G. KartalS. TimurC. Arslan Special Issue Paper Pages: 1538 - 1542
Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with Ti/Cu/Ni under bump metallization during reflow soldering Kai-Zheng WangChih-Ming Chen Regular Issue Paper Pages: 1543 - 1549
Evaluation of solder joint reliability in flip-chip packages during accelerated testing Jong-Woong KimDae-Gon KimSeung-Boo Jung Regular Issue Paper Pages: 1550 - 1557
The formation of epitaxial hexagonal boron nitride on nickel substrates P. C. YangJ. T. PraterR. F. Davis Regular Issue Paper Pages: 1558 - 1564
Reliability of In-48Sn solder/Au/Ni/Cu BGA packages during reflow process Ja-Myeong KooSeung-Boo Jung Regular Issue Paper Pages: 1565 - 1572
Monolayer-protected silver nano-particle-based anisotropic conductive adhesives: Enhancement of electrical and thermal properties Yi LiKyoung-Sik MoonC. P. Wong Regular Issue Paper Pages: 1573 - 1578
Whisker growth on surface treatment in the pure tin plating Kyung-Seob KimWan-Ok HanSung-Won Han Regular Issue Paper Pages: 1579 - 1585
Analytical equations for predicting the thermal properties of isotropic conductive adhesives Masahiro InoueTakahiro SugimuraKatsuaki Suganuma Regular Issue Paper Pages: 1586 - 1590
Formation of bulk Ag3Sn intermetallic compounds in Sn-Ag lead-free solders in solidification J. ShenY. C. LiuY. Q. Yang Regular Issue Paper Pages: 1591 - 1597
The effect of forming gas anneal on the oxygen content in bonded copper layer C. S. TanK. N. ChenR. Reif Regular Issue Paper Pages: 1598 - 1602