1. Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions

   • F. Tai
   • F. Guo
   • Y. W. Shi

   Regular Issue Paper Pages: 1357 - 1362

2. Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

   • Q. L. Yang
   • J. K. Shang

   Regular Issue Paper Pages: 1363 - 1367

3. Cadmium sulfide passivation of InGaAs/InP mesa p-i-n photodiodes

   • W. A. Teynor
   • K. Vaccaro
   • W. R. Clark

   Regular Issue Paper Pages: 1368 - 1372

4. Creep resistance of tin-based lead-free solder alloys

   • M. L. Huang
   • C. M. L. Wu
   • L. Wang

   Regular Issue Paper Pages: 1373 - 1377

5. Refractive indices variation with temperature and humidity of optical adhesive

   • A. Priyadarshi
   • L. Shimin
   • V. Kripesh

   Regular Issue Paper Pages: 1378 - 1384

6. Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads

   • Hui-Min Wu
   • Feng-Chih Wu
   • Tung-Han Chuang

   Regular Issue Paper Pages: 1385 - 1390

7. Influence of native defects on the infrared transmission of undoped Ga_1−xIn_xSb bulk crystals

   • H. J. Kim
   • A. Chandola
   • P. S. Dutta

   Regular Issue Paper Pages: 1391 - 1398

8. Development of nano-composite lead-free electronic solders

   • Andre Lee
   • K. N. Subramanian

   Regular Issue Paper Pages: 1399 - 1407

9. Characterization of sputtered nano-crystalline zirconium carbide as a diffusion barrier for Cu metallization

   • Cheng-Shi Chen
   • Chuan-Pu Liu

   Regular Issue Paper Pages: 1408 - 1413

10. Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method

    • Lianwen Wang
    • Ai-Ping Xian

    Regular Issue Paper Pages: 1414 - 1419

11. Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

    • Liqiang Cao
    • Shiming Li
    • Johan Liu

    Regular Issue Paper Pages: 1420 - 1427

12. Optical emission characteristics of ablation plasma plumes during the laser-etching process of CdTe

    • K. Abe
    • O. Eryu
    • K. Yasuda

    Regular Issue Paper Pages: 1428 - 1431

13. Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization

    • Hongjin Jiang
    • Kyoung-Sik Moon
    • C. P. Wong

    Regular Issue Paper Pages: 1432 - 1439

14. Etching of mesa structures in HgCdTe

    • V. Srivastav
    • R. Pal
    • H. P. Vyas

    Regular Issue Paper Pages: 1440 - 1445

15. Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer

    • Seung-Hyun Lee
    • Hee-Ra Roh
    • Young-Ho Kim

    Regular Issue Paper Pages: 1446 - 1454

16. Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

    • J. W. Hwang
    • M. J. Yim
    • K. W. Paik

    Regular Issue Paper Pages: 1455 - 1461

17. Radiation hardness improvement of separation-by-implantation-of-oxygen/silicon-on-insulator material by nitrogen ion implantation

    • Enxia Zhang
    • Jiayin Sun
    • Zhongli Liu

    Letter Pages: L53 - L56