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Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads

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Abstract

The intermetallic compounds formed during the reflow and aging of Sn-20In-2.8Ag ball-grid-array (BGA) packages are investigated. After reflow, a large number of cubic-shaped AuIn2 intermetallics accompanied by Ag2In precipitates appear in the solder matrix, while a Ni(Sn0.72Ni0.28)2 intermetallic layer is formed at the solder/pad interface. With further aging at 100°C, many voids can be observed in the solder matrix and at the solder/pad interface. The continuous distribution of voids at the interface of specimens after prolonged aging at 100°C causes their bonding strength to decrease from 5.03 N (as reflowed) to about 3.50 N. Aging at 150°C induces many column-shaped (Cu0.74Ni0.26)6(Sn0.92In0.08)5 intermetallic compounds to grow rapidly and expand from the solder/pad interface into the solder matrix. The high microhardness of these intermetallic columns causes the bonding strength of the Sn-20In-2.8Ag BGA solder joints to increase to 5.68 N after aging at 150°C for 500 h.

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Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan

    Hui-Min Wu, Feng-Chih Wu & Tung-Han Chuang

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  1. Hui-Min Wu
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  2. Feng-Chih Wu
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  3. Tung-Han Chuang
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Wu, HM., Wu, FC. & Chuang, TH. Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads. J. Electron. Mater. 34, 1385–1390 (2005). https://doi.org/10.1007/s11664-005-0195-1

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  • DOI: https://doi.org/10.1007/s11664-005-0195-1

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