Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions F. TaiF. GuoY. W. Shi Regular Issue Paper Pages: 1357 - 1362
Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect Q. L. YangJ. K. Shang Regular Issue Paper Pages: 1363 - 1367
Cadmium sulfide passivation of InGaAs/InP mesa p-i-n photodiodes W. A. TeynorK. VaccaroW. R. Clark Regular Issue Paper Pages: 1368 - 1372
Creep resistance of tin-based lead-free solder alloys M. L. HuangC. M. L. WuL. Wang Regular Issue Paper Pages: 1373 - 1377
Refractive indices variation with temperature and humidity of optical adhesive A. PriyadarshiL. ShiminV. Kripesh Regular Issue Paper Pages: 1378 - 1384
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads Hui-Min WuFeng-Chih WuTung-Han Chuang Regular Issue Paper Pages: 1385 - 1390
Influence of native defects on the infrared transmission of undoped Ga1−xInxSb bulk crystals H. J. KimA. ChandolaP. S. Dutta Regular Issue Paper Pages: 1391 - 1398
Development of nano-composite lead-free electronic solders Andre LeeK. N. Subramanian Regular Issue Paper Pages: 1399 - 1407
Characterization of sputtered nano-crystalline zirconium carbide as a diffusion barrier for Cu metallization Cheng-Shi ChenChuan-Pu Liu Regular Issue Paper Pages: 1408 - 1413
Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method Lianwen WangAi-Ping Xian Regular Issue Paper Pages: 1414 - 1419
Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications Liqiang CaoShiming LiJohan Liu Regular Issue Paper Pages: 1420 - 1427
Optical emission characteristics of ablation plasma plumes during the laser-etching process of CdTe K. AbeO. EryuK. Yasuda Regular Issue Paper Pages: 1428 - 1431
Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization Hongjin JiangKyoung-Sik MoonC. P. Wong Regular Issue Paper Pages: 1432 - 1439
Etching of mesa structures in HgCdTe V. SrivastavR. PalH. P. Vyas Regular Issue Paper Pages: 1440 - 1445
Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer Seung-Hyun LeeHee-Ra RohYoung-Ho Kim Regular Issue Paper Pages: 1446 - 1454
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly J. W. HwangM. J. YimK. W. Paik Regular Issue Paper Pages: 1455 - 1461
Radiation hardness improvement of separation-by-implantation-of-oxygen/silicon-on-insulator material by nitrogen ion implantation Enxia ZhangJiayin SunZhongli Liu Letter Pages: L53 - L56