1. Letter from the editor

   • Theodore C. Harman

   Letter Pages: 827 - 827

2. Foreword

   • David Zubia

   EditorialNotes Pages: 828 - 828

3. New layer transfers obtained by the SmartCut process

   • H. Moriceau
   • F. Fournel
   • C. Mazuré

   Special Issue Paper Pages: 829 - 835

4. An anisotropic elasticity model of strain partitioning in epitaxial thin layers

   • Peter Wakeland
   • Tariq Khraishi
   • David Zubia

   Special Issue Paper Pages: 836 - 841

5. Gas-cluster ion-beam smoothing of chemo-mechanical-polish processed GaSb(100) substrates

   • L. P. Allen
   • T. G. Tetreault
   • C. Sung

   Special Issue Paper Pages: 842 - 848

6. Heterogeneous silicon integration by ultra-high vacuum wafer bonding

   • M. J. Kim
   • R. W. Carpenter

   Special Issue Paper Pages: 849 - 854

7. Growth of GaN on porous SiC and GaN substrates

   • C. K. Inoki
   • T. S. Kuan
   • I. Adesida

   Special Issue Paper Pages: 855 - 860

8. Improvement of heteroepitaxial growth by the use of twist-bonded compliant substrate: Role of the surface plasticity

   • G. Patriarche
   • E. Le Bourhis

   Special Issue Paper Pages: 861 - 867

9. Crystalline oxide-based devices on silicon substrates

   • K. Eisenbeiser
   • R. Droopad
   • D. Penunuri

   Special Issue Paper Pages: 868 - 871

10. Layer-transfer process for silicon-on-insulator with improved manufacturability

    • Alexander Usenko

    Special Issue Paper Pages: 872 - 876

11. Wafer bonding for III–V on insulator structures

    • S. Hayashi
    • D. Bruno
    • M. S. Goorsky

    Special Issue Paper Pages: 877 - 881

12. HgCdTe on Si: Present status and novel buffer layer concepts

    • T. D. Golding
    • O. W. Holland
    • W. P. Kirk

    Special Issue Paper Pages: 882 - 889

13. Enhanced thermal stability of a sputtered titanium-nitride film as a diffusion barrier for capacitor-bottom electrodes

    • Dong-Soo Yoon
    • Jae Sung Roh
    • Hong Koo Baik

    Special Issue Paper Pages: 890 - 898

14. Bake stability of CdTe and ZnS on HgCdTe: An x-ray photoelectron spectroscopy study

    • S. K. Jha
    • P. Srivastava
    • B. B. Gong

    Special Issue Paper Pages: 899 - 905

15. Interfacial microstructure evolution in Pb-free solder systems

    • K. Y. Lee
    • M. Li

    Special Issue Paper Pages: 906 - 912

16. Determination of carrier-transfer length from side-wall quantum well to quantum wire by micro-photoluminescence scanning

    • Z. -F. Li
    • W. Lu
    • C. Jagadish

    Special Issue Paper Pages: 913 - 916