Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability I. E. AndersonJ. C. FoleyO. Unal Regular Issue Paper Pages: 1050 - 1059
Influence of alloy composition on fillet-lifting phenomenon in Sn-Ag-Bi alloys H. TakaoH. Hasegawa Regular Issue Paper Pages: 1060 - 1067
Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact Kwang-Lung LinHui-Min Hsu Regular Issue Paper Pages: 1068 - 1072
Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles F. GuoJ. LeeK. N. Subramanian Regular Issue Paper Pages: 1073 - 1082
The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au H. G. SongJ. P. AhnJ. W. Morris Regular Issue Paper Pages: 1083 - 1087
Observations of microstructural coarsening in micro flip-chip solder joints Monica M. BarneyJ. W. Morris Regular Issue Paper Pages: 1088 - 1092
Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system X. J. LiuH. S. LiuK. Yamaguchi Regular Issue Paper Pages: 1093 - 1103
Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys Z. MoserW. GasiorJ. Pstrus Regular Issue Paper Pages: 1104 - 1111
Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems Jong Ho LeeDong Nyung Lee Regular Issue Paper Pages: 1112 - 1119
Studies of the Ag-In phase diagram and surface tension measurements Z. MoserW. GasiorK. Ishida Regular Issue Paper Pages: 1120 - 1128
Morphological stability of solder reaction products in flip chip technology K. N. TuFiona KuT. Y. Lee Regular Issue Paper Pages: 1129 - 1132
Interfacial reactions in the Sn-Ag/Au couples Sinn-Wen ChenYee-Wen Yen Regular Issue Paper Pages: 1133 - 1137
Kinetics of Au-containing ternary intermetallic redeposition at solder/UBM interface Jong-Hyun LeeJong-Hwan ParkYong-Seog Kim Regular Issue Paper Pages: 1138 - 1144
Interfacial reactions between a Pb-Free solder and die backside metallizations G. GhoshM. J. Pfeifer Regular Issue Paper Pages: 1145 - 1151
Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish C. M. LiuC. E. HoC. R. Kao Regular Issue Paper Pages: 1152 - 1156
The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure A. ZribiA. ClarkE. J. Cotts Regular Issue Paper Pages: 1157 - 1164
Investigation of interfacial reaction between Sn-Ag eutectic solder and Au/Ni/Cu/Ti thin film metallization J. Y. ParkC. W. YangC. S. Kang Regular Issue Paper Pages: 1165 - 1170
Intermetallic growth of wire-bond at 175°C high temperature aging Hen-So ChangJ. X. PonC. C. Chen Regular Issue Paper Pages: 1171 - 1177
The creep of lead-free solders at elevated temperatures W. J. PlumbridgeC. R. GaggS. Peters Regular Issue Paper Pages: 1178 - 1183
Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach Yoshiharu KariyaTomoo MorihataMasahisa Otsuka Regular Issue Paper Pages: 1184 - 1189
Constitutive and damage model for a lead-free solder Shengmin WenLeon M. KeerHareesh Mavoori Regular Issue Paper Pages: 1190 - 1196
Stress relaxation behavior of composite and eutectic Sn-Ag solder joints S. G. JadhavT. R. BielerJ. P. Lucas Regular Issue Paper Pages: 1197 - 1205
Application of an asymmetrical four point bend shear test to solder joints Ö. UnalI. E. AndersonJ. C. Foley Regular Issue Paper Pages: 1206 - 1213
Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests B. A. CookI. E. AndersonF. C. Laabs Regular Issue Paper Pages: 1214 - 1221
Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles F. GuoJ. LeeT. R. Bieler Regular Issue Paper Pages: 1222 - 1227
Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys Noboru WadeKepeng WuKazuya Miyahara Regular Issue Paper Pages: 1228 - 1231
The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders C. M. ChuangT. S. LuiL. H. Chen Regular Issue Paper Pages: 1232 - 1240
Microstructural evolution in the Sn-Cu-Ni and Pb-Sn solder joints with Cu and Pt-Ag metallized Al2O3 substrate C. C. YoungJ. G. DuhS. Y. Tsai Regular Issue Paper Pages: 1241 - 1248
Pulsed electrodeposition of the eutectic Au/Sn solder for optoelectronic packaging B. DjurforsD. G. Ivey Regular Issue Paper Pages: 1249 - 1254
Laser soldering for chip-on-glass mounting in flat panel display application Jong-Hyun LeeWon-Yong KimYong-Seog Kim Regular Issue Paper Pages: 1255 - 1261
Electroless Ni/Immersion Au interconnects: Investigation of black pad in wire bonds and solder joints P. SnugovskyP. ArrowsmithM. Romansky Regular Issue Paper Pages: 1262 - 1270
