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Observations of microstructural coarsening in micro flip-chip solder joints

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Abstract

Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints. The lead-tin solder joints in this study have a height of 55 5 m and a tin content of 65–70 wt.%, with a degenerate eutectic microstructure. The joint microstructure coarsens more rapidly during aging at 160°C than cycling from 0–160°C. No coarsened bands are observed. The cycling data scales with standard coarsening equations, while the aging data fits to an enhanced trend. The joints experiencing 2.8% strain during cycling fail by 1000 cycles.

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Authors and Affiliations

  1. Materials Sciences Division, Ernest Orlando Lawrence Berkeley National Laboratory, One Cyclotron Road, MS 66-200, 94720, Berkeley, CA, USA

    Monica M. Barney & J. W. Morris

  2. Chemistry and Materials Science Directorate, Lawrence Livermore National Laboratory, University of California, P.O. Box 808, 94550, Livermore, CA, USA

    Monica M. Barney

Authors
  1. Monica M. Barney
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  2. J. W. Morris
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Barney, M.M., Morris, J.W. Observations of microstructural coarsening in micro flip-chip solder joints. J. Electron. Mater. 30, 1088–1092 (2001). https://doi.org/10.1007/s11664-001-0134-8

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  • DOI: https://doi.org/10.1007/s11664-001-0134-8

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