Evaluation of ultra-low-k dielectric materials for advanced interconnects C. JinS. LinJ. T. Wetzel Special Issue Paper Pages: 284 - 289
Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films S. H. LauEllie TolentinoAnn Koo Special Issue Paper Pages: 299 - 303
Structure and property characterization of low-k dielectric porous thin films Barry J. BauerEric K. LinWen-Li Wu Special Issue Paper Pages: 304 - 308
Synthesis and characterization of porous polymeric low dielectric constant films Yuhuan XuD. W. ZhengC. H. Tung Special Issue Paper Pages: 309 - 313
Material and process challenges in 100 nm interconnects module technology and beyond Takayuki Ohba Special Issue Paper Pages: 314 - 319
Microstructural characterization of inlaid copper interconnect lines Paul R. BesserEhrenfried ZschechElizabeth Weitzman Special Issue Paper Pages: 320 - 330
Microstructure examination of copper wafer bonding Kuan-Neng ChenAndy FanRafael Reif Special Issue Paper Pages: 331 - 335
TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology Huseyin KizilGusung KimBin Zhao Special Issue Paper Pages: 345 - 348
Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films R. FangH. GuR. Cortez Special Issue Paper Pages: 349 - 354
Material and electrical properties of electroless Ag-W thin film A. InbergY. Shacham-DiamandN. Croitoru Special Issue Paper Pages: 355 - 359
Comparative study on the effect of misalignment on bordered and borderless contacts J. S. HuangA. S. OatesY. S. Obeng Special Issue Paper Pages: 360 - 366
Local Joule heating and overall resistance increase in void-containing aluminum interconnects Y. L. Shen Special Issue Paper Pages: 367 - 371
Material issues in electronic interconnects and packaging K. N. SubramanianA. LeeP. Sonje Special Issue Paper Pages: 372 - 378
Interactions between solder and metallization during long-term aging of advanced microelectronic packages C. E. HoW. T. ChenC. R. Kao Special Issue Paper Pages: 379 - 385
Stress testing of a recrystallizing CaO-B2O3-SiO2 glass-ceramic with Ag electrodes for high frequency electronic packaging Andrew A. ShapiroNeil KubotaMartha L. Mecartney Special Issue Paper Pages: 386 - 390
Influence of oxides on friction during Cu CMP Hong LiangJean-Michel MartinRichard Lee Special Issue Paper Pages: 391 - 395
Cu-CMP for dual damascene technology: Prestonian vs. non-prestonian regimes of Cu removal Y. GotkisS. Guha Special Issue Paper Pages: 396 - 399
A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation Guanghui FuAbhijit Chandra Special Issue Paper Pages: 400 - 408
Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization H. G. SongJ. P. AhnJ. W. Morris Regular Issue Paper Pages: 409 - 414
Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials J. ZhaoY. MutohA. J. McEvily Special Issue Paper Pages: 415 - 421
Grain growth simulation of [001] textured YBCO films grown on (001) substrates with large lattice misfit: Prediction of misorientations of the remaining boundaries Jack W. H. TsaiShiun LingSiu-Wai Chan Special Issue Paper Pages: 422 - 431
Reduction of photoresist usage during spin coating Fu-Chu ChouMin-Wen WangZen-Gi Yang Special Issue Paper Pages: 432 - 438
Relaxation of InGaN thin layers observed by X-ray and transmission electron microscopy studies Z. Liliental-WeberM. BenamaraS. M. Bedair Special Issue Paper Pages: 439 - 444
Phase equilibria in transition metal Al-Ga-N systems and thermal stability of contacts to AlGaN K. O. SchweitzS. E. Mohney Erratum Pages: 445 - 445
