Abstract
CaO−B2O3−SiO2 recrystallizing glass-ceramics are attractive for use in microelectronics packaging since they can be processed at low temperatures (<950°C) and the resultant material has a low loss tangent. This paper reports on the stability of the Ag electrodes with respect to electromigration. Planer multilayer recrystallizing glass-ceramic/Ag samples were prepared and fired at temperatures from 800–950°C. Buried capacitor structures with Ag plates 10 mm in diameter with a separation distance of 0.1 mm were created. These were stressed with voltages from 50 V to 3 kV at temperatures from 25°C to 200°C to induce failure. Failure modes observed ranged from increased, leakage to catastrophic events. A population was analyzed for mean time to failure characteristics. SEM and EDX were used to try to identify leakage paths and movement of the Ag through the glass ceramic. An activation energy was determined for the most common failure mode.
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Shapiro, A.A., Kubota, N., Yu, K. et al. Stress testing of a recrystallizing CaO-B2O3-SiO2 glass-ceramic with Ag electrodes for high frequency electronic packaging. J. Electron. Mater. 30, 386–390 (2001). https://doi.org/10.1007/s11664-001-0048-5
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DOI: https://doi.org/10.1007/s11664-001-0048-5