Development of under bump metallizations for flip chip bonding to organic substrates T. M. KorhonenP. SuC. -Y. Li Special Issue Paper Pages: 1146 - 1149
Reliability of a flip-chip package thermally loaded between −55°C and 125°C Elizabeth S. Drexler Special Issue Paper Pages: 1150 - 1157
A novel test circuit for automatically detecting electrochemical migration and conductive anodic filament formation W. Jud ReadyLaura J. TurbiniJohn Fischer Special Issue Paper Pages: 1158 - 1163
Thermodynamic database for phase diagrams in micro-soldering alloys I. OhnumaX. J. LiuK. Ishida Special Issue Paper Pages: 1164 - 1171
Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use T. ShimizuH. IshikawaK. Ishida Special Issue Paper Pages: 1172 - 1175
Microstructural engineering of solders K. N. SubramanianT. R. BielerJ. P. Lucas Special Issue Paper Pages: 1176 - 1183
Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements Jeff SigelkoS. ChoiT. R. Bieler Special Issue Paper Pages: 1184 - 1188
Forming high temperature solder joints through liquid phase sintering of solder paste Mark A. PalmerNicole S. ErdmanDavid A. McCall Special Issue Paper Pages: 1189 - 1193
An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates S. ChadaW. LaubD. Shangguan Special Issue Paper Pages: 1194 - 1202
Interfacial reactions in Ag-Sn/Cu couples Sinn-Wen ChenYee-Wen Yen Special Issue Paper Pages: 1203 - 1208
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging S. ChoiT. R. BielerK. N. Subramanian Special Issue Paper Pages: 1209 - 1215
Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly Hitoshi TanakaMorimasa TanimotoShoji Shiga Special Issue Paper Pages: 1216 - 1223
Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions A. S. ZuruziC. -H. ChiuK. M. Chua Special Issue Paper Pages: 1224 - 1230
Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering C. E. HoY. M. ChenC. R. Kao Special Issue Paper Pages: 1231 - 1237
Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Pd metallizations G. Ghosh Special Issue Paper Pages: 1238 - 1250
Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate Won Kyoung ChoiHyuck Mo Lee Special Issue Paper Pages: 1251 - 1255
The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders Jae Yong ParkChoon Sik KangJae Pil Jung Special Issue Paper Pages: 1256 - 1262
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints Yoshiharu KariyaYasunori HirataMasahisa Otsuka Special Issue Paper Pages: 1263 - 1269
Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique J. P. LucasF. GuoJ. K. Park Special Issue Paper Pages: 1270 - 1275
Solder joint reliability in alternator power diode assemblies Tsung-Yu PanSteven C. WhiteJohn M. Nicholson Special Issue Paper Pages: 1276 - 1285
Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy Noboru WadeTatsuo AkuzawaKazuya Miyahara Special Issue Paper Pages: 1286 - 1289
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue P. T. ViancoS. N. BurchettD. R. Frear Special Issue Paper Pages: 1290 - 1298
Characterizing the weak organic acids used in low solids fluxes Brian A. SmithLaura J. Turbini Special Issue Paper Pages: 1299 - 1306
Z-Axis anisotropic electrical conductor films in adhesive and standalone forms for electrical interconnection Yunsheng XuD. D. L. Chung Special Issue Paper Pages: 1307 - 1313
Development of conducting adhesive materials for microelectronic applications Sung K. KangS. Purushothaman Special Issue Paper Pages: 1314 - 1318
Transient liquid phase sintering composites: Polymer adhesives with metallurgical bonds Catherine ShearerBryan ShearerPradeep Gandhi Special Issue Paper Pages: 1319 - 1326
