Abstract
To analyze the withdrawal force curve in the wetting balance curve, wetting balance tests using the 63Sn-37Pb and 96.5Sn-3.6Ag eutectic solders were conducted by varying the immersion speed, sample perimeter, and solder temperature. The mechanism of the withdrawal force curve was reviewed and a new method for calculating the surface tension of solders using the withdrawal force curve was introduced. The results showed that the maximum point of the withdrawal force curve is generated when the sliding solder meets the bottom corners of a sample and the contact angle is reduced to zero. The maximum withdrawal force subtracted by end force can be expressed using force balance equation as F=pγ. Therefore, the surface tension of the solder can be calculated by dividing the maximum withdrawal force by the sample parameter.
Similar content being viewed by others
References
Y.C. Lee and W.T. Chen, Manufacturing Challenges in Electronic Packaging (London: Chapman & Hall, 1998), p. 82.
R.J. Klein-Wassink, Soldering in Electronics (Ayr, Scotland: Electrochemical Publications, 1984), pp. 45 and 303.
C. Lea, Soldering & Surface Mount Technol. 4, 8 (1990).
C. Lea and W.A. Dench, Soldering & Surface Mount Technol. 4, 14 (1990).
C. Lea, Soldering & Surface Mount Technol. 7, 10 (1991).
K.W. Moon, W.J. Boettinger, M.E. Williams, D. Josel, B.T. Murray, W.C. Carter, and C.A. Handwerker, J. Electron. Packaging 118, 174 (1996).
D.C. Whalley and P.P. Conway, J. Electron. Packaging 118, 134 (1996).
J.Y. Park, J.P. Jung, C.S. Kang, and Y.E. Shin, Proc. 5th Symp. Microjoining and Assemble Technol. in Electron. (Osaka, Japan: JWS, 1999), p. 295.
J.Y. Park, J.P. Jung, and C.S. Kang, IEEE Trans. Compon. and Pkg. Technol. (to be published).
F.G. Yost, The Metal Science of Joining, ed. M.J. Cieslak, J.H. Perepezko, S. Kang, and M.E. Glicksman (Warrendale, PA: TMS, 1992), p. 49.
P.T. Vianco, The Metal Science of Joining, ed. M.J. Cieslak, J.H. Perepezko, S. Kang, and M.E. Glicksman (Warrendale, PA: TMS, 1992), p. 265.
A. Mayhew and K. Monger, Proc. Inter. NEPCON (1972), p. 53
H. Takao, H. Hasegawa, T. Tsukada, M. Mizuno, K. Yamada, and S. Yamamoto, Proc. 2nd Symp. Microjoining and Assembly Technol. in Electron. (Osaka, Japan: JWS, 1999), p. 101.
I. Artaki, A.M. Jackson, and P.T. Vianco, JEM 23, 757 (1994).
Judith Glazer, JEM 23, 693 (1994).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Park, J.Y., Kang, C.S. & Jung, J.P. The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders. J. Electron. Mater. 28, 1256–1262 (1999). https://doi.org/10.1007/s11664-999-0165-0
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-999-0165-0