Abstract
The reliability of solders, especially under service conditions, is strongly influenced by their behavior under creep, thermomechanical fatigue, creep-fatigue interactions and the effects of aging on these properties. Stabilization of the solder microstructure during service will also significantly help in reliability prediction modeling. Among the various methods used to improve reliability and microstructure stabilization, one that holds significant promise, is the incorporation of compatible reinforcements by in-situ methods. The composite solder produced by utilizing this strategy exhibits improved properties that are likely to enhance service performance.
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References
C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater. 23, 595 (1994).
M. McCormack, S. Jin, and G.W. Kammlott, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A 17, 452 (1994).
C.G. Kue, S.M.L. Sastry, and K.L. Jerina, Proc. First Int. Conf. on Microstructures and Mechanical Properties of Aging Materials, ed. P.K. Liaw et al. (Warrendale, PA: TMS, 1993), p. 409.
R.B. Clough, R. Patel, J.S. Hwang, and G. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1256.
M.A. Wasynczuk and G.K. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1245.
J.L. Marshall and J. Calderon, Soldering and Surface Mount Technol. 26, 13 (1997).
National Center for Manufacturing Sciences, Lead Free Solder Project Final Report (August 1997).
J.P. Lucas, A.W. Gibson, K.N. Subramanian, and T. R. Bieler, Proc. MRS Spring Meeting, 522 (Warrendale, PA: MRS, 1998), p. 339.
A.W. Gibson, S.L. Choi, K.N. Subramanian, and T.R. Bieler, Design and Reliability of Solders and Solder Joint, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1997), p. 91.
S.L. Choi, A.W. Gibson, J.L. McDougall, T.R. Bieler, and K.N. Subramanian, Design and Reliability of Solders and Solder Joints, ed. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1977), p. 241.
K.N. Subramanian, T.R. Bieler, and J.P. Lucas, Key Engineering Materials, Part I, ed. H. Neber-Aeschbacher and F.H. Wohlbier (Switzerland: Trans. Tech. Ltd., 1995), p. 175.
J. McDougall, S. Choi, T.R. Bieler, K.N. Subramanian, and J.P. Lucas, Mater. Sci. and Eng. (in press).
W.F. Smith, Structure and Properties of Engineering Alloys, Second Edition (New York: McGraw-Hill, 1993), p. 506.
A.W. Gibson, K.N. Subramanian, and T.R. Bieler, J. Adv. Mater. 30, 19 (1998).
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Subramanian, K.N., Bieler, T.R. & Lucas, J.P. Microstructural engineering of solders. J. Electron. Mater. 28, 1176–1183 (1999). https://doi.org/10.1007/s11664-999-0154-3
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DOI: https://doi.org/10.1007/s11664-999-0154-3