Equations of exposure time and X-ray mask absorber thickness in the LIGA process K. H. GilS. S. LeeY. Youm Pages: 1 - 5
Non-adhesive direct bonding of tiny parts by means of ultraprecision trapezoid microgrooves Y. TakeuchiO. MiyagawaT. Sata Pages: 6 - 10
Gas permeability of adhesives and their application for hermetic packaging of microcomponents A. GerlachW. KellerK. Schumacher Pages: 17 - 22
Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques A. GerlachP. ZieglerJ. Mohr Pages: 27 - 31
Fabrication method of spacers with high aspect ratio – Used in a field emission display (FED) S. ParkM. Kim Pages: 32 - 35
Consumption-related development in microelectroforming N. N. IssaevA. G. SchrodtC. Khan Malek Pages: 44 - 46