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Consumption-related development in microelectroforming

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Abstract

 High-aspect ratio microelectroforming is one of the most challenging techniques in MEMS microfabrication. This is particularly true with plating metal into the very tall micropatterned polymer molds made by X-ray lithography for primary or secondary metal structures or metal mold inserts within the framework of the LIGA process. Among various problems are: (1) the time consumption in plating very tall parts or using microelectroplating as a replication technique; (2) the cost of material, in particular in the formation of very high-aspect-ratio absorber structures for X-ray masks in the deep and ultra-deep X-ray lithography step.

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Authors and Affiliations

  1. TVJ Electroforming Division, Dover Industrial Chrome, Inc., 2929 N. Campbell Ave., Chicago IL 60618, USA E-mail: tvjdover@mcs.com, , , , , , US

    N. N. Issaev & A. G. Schrodt

  2. Center for Advanced Microstructures and Devices, Louisiana State University, 6980 Jefferson Highway, Baton Rouge, LA 70806, USA E-mail: chantal@lsu.edu, , , , , , US

    C. Khan Malek

Authors
  1. N. N. Issaev
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  2. A. G. Schrodt
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  3. C. Khan Malek
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Received: 7 July 2000/Accepted: 23 August 2000

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Issaev, N., Schrodt, A. & Khan Malek, C. Consumption-related development in microelectroforming. Microsystem Technologies 7, 44–46 (2001). https://doi.org/10.1007/s005420000072

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  • DOI: https://doi.org/10.1007/s005420000072

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