Fabrication method of spacers with high aspect ratio – Used in a field emission display (FED)

Abstract

Glass to glass anodic bonding using a metal interlayer was used to develop a fabrication method of spacer for field emission display (FED). In this paper, spacers with width 100 μm and height 1000 μm and a 3.54 inch mono color anode plate patterned with Al/Cr film as an interlayer were bonded by the anodic bonding. To bond the spacers on the anode plate vertically, two types of spacer holders were designed and fabricated with photoetchable glass and n(110) Si wafer. The spacer holder using Si wafer was used to fabricate for evacuated FED panel.