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Microcomposite electroforming for LIGA technology

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Abstract

 Effective methods to improve hardness and thickness uniformity in electroforming for the LIGA process to produce metallic microstructures are described. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 to −2 kg/mm2 by adding a stress release agent into the electroplating bath. A secondary cathode is applied to improve the thickness uniformity in electroforming without loss plating rate at the center of the features.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, , , , , , TW

    M.-C. Chou

  2. Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, , , , , , TW

    H. Yang

  3. Material Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, , , , , , TW

    S.-H. Yeh

Authors
  1. M.-C. Chou
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  2. H. Yang
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  3. S.-H. Yeh
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Received: 7 July 1999/Accepted: 25 November 1999

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Chou, MC., Yang, H. & Yeh, SH. Microcomposite electroforming for LIGA technology. Microsystem Technologies 7, 36–39 (2001). https://doi.org/10.1007/s005420000063

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  • DOI: https://doi.org/10.1007/s005420000063

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