International Conference on High Aspect Ratio Microstructure Technology HARMST ’97 Peter Bley Editorial Pages: 1 - 1
Research, development and manufacturing plans at CAMD C. Khan MalekH. ManoharaV. Saile Technical papers Pages: 2 - 6
Low Z substrates for cost effective high-energy, stacked exposures H. M. ManoharaC. Khan MalekK. Deng Pages: 17 - 20
Automated array assembly: a high throughput, low cost assembly process for LIGA-fabricated micro-components C. M. EgertK. W. Hylton Pages: 25 - 27
Various replication techniques for manufacturing three-dimensional metal microstructures R. RuprechtT. BenzlerJ. Haußelt Pages: 28 - 31
Systemintegration of microsystems/chip elements in miniaturized automata for high-throughput synthesis and screening in biology, biochemistry and chemistry A. SchoberG. SchlingloffG. Mayer Pages: 35 - 39
Tensile testing device for microstructured specimens A. IlzhöferH. SchneiderC. Tsakmakis Pages: 46 - 50