1. MRS FAQs (MRS Frequently Asked Questions)

   • Merrilea J. Mayo

   Letter from the President 31 January 2011 Pages: 3 - 3

2. Simultaneous Spin and Structure Maps by Spin-Polarized STM

   • Greg Khitrov

   Research/Researchers 31 January 2011 Pages: 4 - 4

3. Nanostructured Copper Achieves Simultaneous High Strength and Ductility

   • Kinson C. Kam

   Research/Researchers 31 January 2011 Pages: 4 - 4

4. Simple Neutron Microscope Uses Refractive Aluminum Lenses

   • Richard Louie

   Research/Researchers 31 January 2011 Pages: 4 - 5

5. Simulations Indicate Aluminum Has a Higher Ideal Shear Strength than Copper

   • Siari S. Sosa

   Research/Researchers 31 January 2011 Pages: 5 - 5

6. Neutrons Used for Holographic Imaging of a Pb Crystal

   • Andrei A. Eliseev

   Research/Researchers 31 January 2011 Pages: 5 - 6

7. Coherent X-Ray Technique Reveals Interface Structure with Sub-Angstrom Resolution

   • Maxim Nikiforov

   Research/Researchers 31 January 2011 Pages: 6 - 6

8. Superconductivity Attained in Compressed Lithium

   • Calin Miclaus

   Research/Researchers 31 January 2011 Pages: 6 - 6

9. Synchrotron Source X-Ray Diffraction Used to Study Phase Transformations in Steel

   • Gopal R. Rao

   Research/Researchers 31 January 2011 Pages: 6 - 7

10. Dolphin Skin Offered as Model for Nanoparticle Coating

    Research/Researchers 31 January 2011 Pages: 7 - 7

11. Science Policy

    BriefCommunication 31 January 2011 Pages: 9 - 10

12. Microelectronics Packaging and Integration

    • Robert H. Reuss
    • Babu R. Chalamala

    OriginalPaper 31 January 2011 Pages: 11 - 20

13. Critical Aspects of High-Performance Microprocessor Packaging

    • Vasudeva P. Atluri
    • Ravi V. Mahajan
    • Ram S. Viswanath

    OriginalPaper 31 January 2011 Pages: 21 - 34

14. Materials for 3D Packaging of Electronic and Optoelectronic Systems

    • Volkan H. Ozguz
    • James Yamaguchi

    OriginalPaper 31 January 2011 Pages: 35 - 40

15. High-Performance Packaging of Power Electronics

    • M. C. Shaw

    OriginalPaper 31 January 2011 Pages: 41 - 50

16. Packaging Options for MEMS Devices

    • Erik Jung

    OriginalPaper 31 January 2011 Pages: 51 - 54

17. Low-Cost Wafer-Level Vacuum Packaging for MEMS

    • Roland Gooch
    • Thomas Schimert

    OriginalPaper 31 January 2011 Pages: 55 - 59

18. Chip-to-Module Interconnections Using “Sea of Leads” Technology

    • Muhannad S. Bakir
    • Hollie A. Reed
    • James D. Meindl

    OriginalPaper 31 January 2011 Pages: 61 - 67

19. Emerging Materials Challenges in Microelectronics Packaging

    • D. R. Frear
    • S. Thomas

    OriginalPaper 31 January 2011 Pages: 68 - 74

20. Mayo Leads MRS Board of Directors in 2003

    MRS News 31 January 2011 Pages: 75 - 77

21. Calendar

    Events 31 January 2011 Pages: 81 - 83

22. Explain Yourself

    • Alex King

    Posterminaries 31 January 2011 Pages: 88 - 88