Copper-Based Metallization for ULSI Applications Jian LiRobert BlewerJ. W. Mayer Copper Metallization 29 November 2013 Pages: 18 - 21
Chemical Vapor Deposition of Copper for Multilevel Metallization Alain E. KaloyerosMichael A. Fury Copper Metallization 29 November 2013 Pages: 22 - 29
Electroless Cu for VLSI James S. H. ChoHo-Kyu KangYosi Shacham-Diamand Copper Metallization 29 November 2013 Pages: 31 - 38
Copper Etching: New Chemical Approaches Mark J. Hampden-SmithToivo T. Kodas Copper Metallization 29 November 2013 Pages: 39 - 45
Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing S. P. MurarkaJ. SteigerwaldR. J. Gutmann Copper Metallization 29 November 2013 Pages: 46 - 51
Refractory Metal Nitride Encapsulation for Copper Wiring Jian LiJ. W. Mayer Copper Metallization 29 November 2013 Pages: 52 - 56
Materials Research Society of India Hosts Fourth Annual General Meeting S. Ranganathan International Union of Materials Research Societies 29 November 2013 Pages: 57 - 58