References
D. Gardner, J. Meindl, and K. Saraswat, Trans. Elec. Dev., 34 (3) (1987) p. 633.
P.L. Pai and C.H. Ting, VMIC (1989) p. 258.
M. Paunovic, Plating, Vol. 55 (1968) p. 1161.
S.S. Wong, J.S. Cho, H.K. Kang, S.S. Wong, and C.H. Ting, Elec. Pack. Mater. Sci. V (1990) p. 347.
J.S.H Cho, H-K. Kang, M.A. Beiley, S.S. Wong, and C.H. Ting, VLSI Tech. Symp. Slide Supplement (1991) p. 37.
Y. Shacham-Diamand, Materials for Electronic Packaging, Butterworth-Heinman, 1993, submitted.
R.E. Wistrom and Y. Shacham-Diamand, Proc. Mater. Elect. Pack. (1991).
H-K. Kang, J.S.H Cho, and S.S. Wong, Elec. Dev. Lett., 13 (9) (1992) p. 448.
T. Ohmi, T. Hoshi, Y. Yoshie, T. Takewaki, M. Otsuki, T. Shibata, and T. Nitta, IEDM Tech Dig. (1991) p. 285.
C.W. Park and R.W. Vook, J. Appl. Phys. Lett., 59 (2) (1991) p. 175.
J. Tao, N.W. Cheung, C. Hu, H.K. Kang, S.S. Wong, Elec. Dev. Lett. 13 (8) (1992) p. 433.
Y. Shacham-Diamand, J. Micromech. Microeng. 11992, p. 66.
Y. Shacham-Diamand, N. Quaid, A. Dedhia, and M. Angyl, J. Vac. Sci. Technol. 10 (6) (1992) p. 2958.
M.H. Kiang, M.A. Lieberman, N.W. Cheung, X.Y. Qian, Appl. Phys. Lett. 60 (22) (1992) p. 2967.
J.S.H Cho, H.K. Kang, M.A. Beiley, S.S. Wong, and C.H. Ting, VLSI Tech. Symp. (1991) p. 39.
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Cho, J.S.H., Kang, HK., Simon Wong, S. et al. Electroless Cu for VLSI. MRS Bulletin 18, 31–38 (1993). https://doi.org/10.1557/S0883769400047308
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DOI: https://doi.org/10.1557/S0883769400047308