Titanium investiment casting defects: A metallographic overview J. D. CottonL. P. ClarkH. R. Phelps Overview Pages: 13 - 16
The microstructural characterization of semi-solid slurries Shahrooz NafisiReza Ghomashchi Overview Pages: 24 - 30
Numerical simulation of high-density plasma-arc processing of FePt nanoparticle films Adrian S. SabauRalph B. Dinwiddie Research Summary Pages: 35 - 38
High-density plasma-arc heating studies of FePt thin films Amanda ColeGregory B. ThompsonRonald Ott Research Summary Pages: 39 - 42
Pulsed-thermal processing of chemically synthesized FePt nanoparticles Shifan ShiShishou KangP. Kadolkar Research Summary Pages: 43 - 45
The pulse-thermal processing of NdFeB-based nanocomposite magnets Z. Q. JinV. M. ChakkaR. D. Ott Research Summary Pages: 46 - 49
An investigation of phase transformation behavior in sputter-deposited PtMn thin films C. -X. JiPeter F. LadwigBharat B. Pant Research Summary Pages: 50 - 54
Lead-free implementation: Reliability, alloy development, and new technology Srinivas Chada Commentary Pages: 56 - 56
Novel rare-earth-containing lead-free solders with enhanced ductility M. A. DudekR. S. SidhuN. Chawla Research Summary Pages: 57 - 62
A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints J. O. SuhK. N. TuN. Tamura Research Summary Pages: 63 - 66
The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging Carl DeppischThomas FitzgeraldMikel Miller Research Summary Pages: 67 - 74
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating Kejun ZengRoger StiermanMasood Murtuza Research Summary Pages: 75 - 79
Reflections on a life of materials science: Robert Cahn and The Art of Belonging Kelly Roncone End Notes Pages: 88 - 88