Conducting Polymers and Their Hybrids as Organic Thermoelectric Materials Naoki ToshimaShoko Ichikawa OriginalPaper 29 July 2014 Pages: 384 - 390
Consideration of Thermoelectric Power Generation by Using Hot Spring Thermal Energy or Industrial Waste Heat Keiichi SasakiDaisuke HorikawaKoichi Goto OriginalPaper 28 May 2014 Pages: 391 - 398
Thermoelectric Properties and Performance of n-Type and p-Type Graphite Intercalation Compounds Rika MatsumotoYusuke OkabeNoboru Akuzawa OriginalPaper 07 October 2014 Pages: 399 - 406
Transmission Electron Microscopy Study of Mg2Si0.5Sn0.5 Solid Solution for High-Performance Thermoelectrics Ji-Wei LiuMinghui SongYukihiro Isoda OriginalPaper 01 October 2014 Pages: 407 - 413
Enhanced Thermoelectric Response of Ca0.96Dy0.02Re0.02MnO3 Ceramics (Re = La, Nd, Sm) at High Temperature Yuanhu ZhuChunlei WangLiangmo Mei OriginalPaper 10 October 2014 Pages: 414 - 419
Combination of PVA with Graphene to Improve the Seebeck Coefficient for Thermoelectric Generator Applications L. MahmoudY. Abdul SamadM. Ismail OriginalPaper 22 October 2014 Pages: 420 - 424
Improvement of the Thermoelectric Figure-of-Merit of a Doped Telluride Nanocomposite by Combining Phonon Scattering with Grain Boundary-Modifying Zn-Containing Nanostructures Michael P. RoweLi Qin ZhouMinjuan Zhang OriginalPaper 23 October 2014 Pages: 425 - 430
The Low-Temperature Seebeck Coefficient in Insulators G. D. Mahan OriginalPaper 04 November 2014 Pages: 431 - 434
Reliability Investigation of Cu/In TLP Bonding Jong-Bum LeeHow-Yuan HwangMin-Woo Rhee OriginalPaper 23 September 2014 Pages: 435 - 441
An Investigation into the Effect of a Post-electroplating Electrochemical Oxidation Treatment on Tin Whisker Formation M. A. AshworthD. HaspelR. J. Mortimer OriginalPaper 18 September 2014 Pages: 442 - 456
Arc-Erosion Behavior of Boric Oxide-Reinforced Silver-Based Electrical Contact Materials Produced by Mechanical Alloying Serkan BiyikFazli ArslanMurat Aydin OriginalPaper 19 September 2014 Pages: 457 - 466
In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process Lin QuNing ZhaoMingliang Huang OriginalPaper 23 September 2014 Pages: 467 - 474
Agitation Effect on the Rheological Behavior of Lithium-Ion Battery Slurries Young Il KwonJong Dae KimYoung Seok Song OriginalPaper 17 September 2014 Pages: 475 - 481
Cyclic Thermal Stress-Induced Degradation of Cu Metallization on Si3N4 Substrate at −40°C to 300°C Fengqun LangHiroshi YamaguchiHiroshi Sato OriginalPaper 17 September 2014 Pages: 482 - 489
Optimization of Inkjet-Printed 6,13-Bis(triisopropylsilylethynyl) pentacene Using Photolithography-Defined Structures D. L. KabirI. MejiaM. A. Quevedo-Lopez OriginalPaper 08 October 2014 Pages: 490 - 496
A Comparative Study on the Conductive Properties of Coated and Printed Silver Layers on a Paper Substrate Cian NashYann SpiesschaertBartlomiej Andrzej Glowacki OriginalPaper 10 October 2014 Pages: 497 - 510
Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn Teng-Kai YangChih-Fan LinChih-Ming Chen OriginalPaper 15 October 2014 Pages: 511 - 517
Effects of Crystal Growth Methods on Deep-Level Defects and Electrical Properties of CdZnTe:In Crystals Lingyan XuWanqi JieXi Chen OriginalPaper 21 October 2014 Pages: 518 - 523
Structural, Magnetic, and Electrical Properties of Microwave-Sintered Cr3+-Doped Sr Hexaferrites K. PraveenaM. BououdinaSadhana Katlakunta OriginalPaper 11 November 2014 Pages: 524 - 531
Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders Jun ShenYayun PuQin Tang OriginalPaper 01 November 2014 Pages: 532 - 541
Characterization and Luminescence Properties of Color-Tunable Dy3+-Doped BaY2ZnO5 Nanophosphors SonikaS.P. KhatkarV.B. Taxak OriginalPaper 29 October 2014 Pages: 542 - 548
Double Gaussian Distribution of Barrier Heights, Interface States, and Current Transport Mechanisms in Au/Bi0.5Na0.5TiO3-BaTiO3/n-GaN MIS Structure V. Rajagopal ReddyV. ManjunathChel-Jong Choi OriginalPaper 04 November 2014 Pages: 549 - 557
Junction and Back Contact Properties of Spray-Deposited M/SnS/In2S3/SnO2:F/Glass (M = Cu, Graphite) Devices: Considerations to Improve Photovoltaic Performance Malkeshkumar PatelAbhijit Ray OriginalPaper 19 November 2014 Pages: 558 - 567
Interfacial Reaction and Mechanical Characterization of Sn–Ag–Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition C.E. HoW.Z. HsiehT.T. Kuo OriginalPaper 02 December 2014 Pages: 568 - 580
Co Effects upon Intermetallics Growth Kinetics in Sn-Cu-Co/Ni and Sn-Cu-Co/Cu Couples Yan-lun TsengYa-chun ChangChih-chi Chen OriginalPaper 02 December 2014 Pages: 581 - 589
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling Linmei YangZ. F. Zhang OriginalPaper 02 December 2014 Pages: 590 - 596
Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing Yong ZuoLimin MaFu Guo OriginalPaper 25 January 2014 Pages: 597 - 603
Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures Ya-Chi ChengYu-Ting WangMing-Tzer Lin OriginalPaper 13 November 2014 Pages: 604 - 611