High-Temperature Thermoelectric Characterization of III–V Semiconductor Thin Films by Oxide Bonding Je-Hyeong BahkGehong ZengJohn E. Bowers OriginalPaper Open access 22 May 2010 Pages: 1125 - 1132
Thermoelectric Properties of Layer-Antiferromagnet CuCrS2 Girish C. TewariT. S. TripathiA. K. Rastogi OriginalPaper 02 April 2010 Pages: 1133 - 1139
Critical Layer Thickness in Exponentially Graded Heteroepitaxial Layers D. SidotiS. XhurxhiJ. E. Ayers OriginalPaper 27 March 2010 Pages: 1140 - 1145
Structural Properties of AlN Grown on Sapphire at Plasma Self-Heating Conditions Using Reactive Magnetron Sputter Deposition Hui-Chan SeoIvan PetrovKyekyoon Kim OriginalPaper 03 June 2010 Pages: 1146 - 1151
Electron–Electron Interactions in Sb-Doped SnO2 Thin Films Tülay SerinAbdullah YildizMehmet Kasap OriginalPaper 22 May 2010 Pages: 1152 - 1158
Improved Thermoelectric Performance and Mechanical Properties of Nanostructured Melt-Spun β-Zn4Sb3 Dekui QiXinfeng TangQingjie Zhang OriginalPaper 08 June 2010 Pages: 1159 - 1165
Sources of Epitaxial Growth-Induced Stacking Faults in 4H-SiC Gan FengJun SudaTsunenobu Kimoto OriginalPaper 07 April 2010 Pages: 1166 - 1169
Interface Formation and Electrical Transport in SnO2:Eu3+/GaAs Heterojunction Deposited by Sol–Gel Dip-Coating and Resistive Evaporation Tatiane F. PineizLuis V. A. ScalviEvandro A. de Morais OriginalPaper 23 March 2010 Pages: 1170 - 1176
Comparative Study on the Properties of Galvanically Deposited Nano- and Microcrystalline Thin Films of PbSe Nillohit MukherjeeAnup Mondal OriginalPaper 14 April 2010 Pages: 1177 - 1185
Optical Study of Filled Tetrahedral Compounds Li3AlN2 and Li3GaN2 M. DadsetaniS. NamjooH. Nejati OriginalPaper 02 June 2010 Pages: 1186 - 1193
Crystallization of Amorphous Si0.6Ge0.4 Nanoparticles Embedded in SiO2: Crystallinity Versus Compositional Stability A. RodríguezT. RodríguezJ. Sangrador OriginalPaper 22 May 2010 Pages: 1194 - 1202
Characterization by Internal Photoemission Spectroscopy of Single-Crystal CVD Diamond Schottky Barrier Diodes Saman MajdiMarkus GabryschJan Isberg OriginalPaper 20 May 2010 Pages: 1203 - 1208
Catalyst-Free Direct Vapor-Phase Growth of Hexagonal ZnO Nanowires on α-Al2O3 S. S. HullavaradN. V. HullavaradA. E. Wickenden OriginalPaper 15 May 2010 Pages: 1209 - 1217
Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Lei NieMaik MuellerMichael Pecht OriginalPaper 14 May 2010 Pages: 1218 - 1232
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders Hiroshi OguraMinoru MaruyamaSeiji Isoda OriginalPaper 01 May 2010 Pages: 1233 - 1240
Improvement of High-Temperature Performance of Zn-Sn Solder Joint Toshihide TakahashiShuichi KomatsuTadashi Takemoto OriginalPaper 28 April 2010 Pages: 1241 - 1247
Crystallographic Properties of Ge/Si Heterojunctions Fabricated by Wet Wafer Bonding Hiroshi KanbeMami HiroseMasafumi Taniwaki OriginalPaper 27 April 2010 Pages: 1248 - 1255
Influence of Cadmium Composition on CH4–H2-Based Inductively Coupled Plasma Etching of Hg1−x Cd x Te F. BoulardJ. BayletC. Cardinaud OriginalPaper 20 April 2010 Pages: 1256 - 1261
Field Emission from Silicon Implanted with Carbon and Nitrogen Followed by Electron Beam Annealing D.A. CarderA. MarkwitzJ. Kennedy OriginalPaper 20 April 2010 Pages: 1262 - 1267
Electrical Conductivity of Graphene Composites with In and In-Ga Alloy A. Naga SrutiK. Jagannadham OriginalPaper 14 April 2010 Pages: 1268 - 1276
Weakening of the Cu/Cu3Sn(100) Interface by Bi Impurities X. Y. PangP. J. ShangJ. K. Shang OriginalPaper 07 April 2010 Pages: 1277 - 1282
A Low-Temperature Bonding Process Using Mixed Cu–Ag Nanoparticles Y. MorisadaT. NagaokaM. Nakamoto OriginalPaper 06 April 2010 Pages: 1283 - 1288
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints C. C. ChangY. W. WangC. R. Kao OriginalPaper 02 April 2010 Pages: 1289 - 1294
Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints S. BelyakovH. V. AtkinsonS. P. A. Gill BriefCommunication 02 April 2010 Pages: 1295 - 1297
Effect of Ag Content on Solidification Cracking Susceptibility of Sn-Ag-Cu Solder Joints Wei LuYaowu ShiYongping Lei OriginalPaper 02 April 2010 Pages: 1298 - 1302
Coupling Effect of the Interfacial Reaction in Co/Sn/Cu Diffusion Couples Chao-hong WangChun-yi Kuo OriginalPaper 02 April 2010 Pages: 1303 - 1308
Effects of Current Stressing on Formation and Evolution of Kirkendall Voids at Sn–3.5Ag/Cu Interface C. YuY. YangJ. M. Chen OriginalPaper 30 March 2010 Pages: 1309 - 1314
The Mechanism of Residual Stress Relief for Various Tin Grain Structures Cheng-Fu YuKer-Chang Hsieh OriginalPaper 08 June 2010 Pages: 1315 - 1318
Thermodynamic Description of the Te-Tl Binary System Using the Associate Solution Model Wojciech Gierlotka OriginalPaper 11 May 2010 Pages: 1319 - 1325
Ti-Rich Barrier Layers Self-Formed on Porous Low-k Layers Using Cu(1 at.% Ti) Alloy Films Kazuhiro ItoKazuyuki KohamaMasanori Murakami OriginalPaper 31 March 2010 Pages: 1326 - 1333
Dielectric and Electrical Conductivity Relaxation in 0.5Li2O-0.5Na2O-2B2O3 Glasses Rahul VaishK.B.R. Varma OriginalPaper 25 March 2010 Pages: 1334 - 1342
Nonvolatile Metal–Oxide–Semiconductor Capacitors with Ru-RuO x Composite Nanodots Embedded in Atomic-Layer-Deposited Al2O3 Films Hong-Yan GouShi-Jin DingZhenyi Chen OriginalPaper 06 May 2010 Pages: 1343 - 1350
Effective Permittivity Calculation of Composites with Interpenetrating Phases Yu ZengHongtao ZhangZhipeng Hu OriginalPaper 27 April 2010 Pages: 1351 - 1357
Reduced Temperature Coefficient of Capacitance (TCC) of Embedded Capacitor Films (ECFs) for Organic Substrates using SrTiO3 and Multifunctional Epoxy Sangyong LeeKyung-Wook Paik OriginalPaper 14 April 2010 Pages: 1358 - 1363
Ti-O Direct-Current-Sintered Bodies and Their Use for Sputter Deposition of TiO Thin Films: Fabrication and Characterization Masanari TomozawaKimihiro OzakiKeizo Kobayashi OriginalPaper 27 March 2010 Pages: 1364 - 1370
