Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap I. OhnumaT. SaegusaK. Ishida OriginalPaper Open access 10 September 2008 Pages: 2 - 9
Cu-Ni-Sn: A Key System for Lead-Free Soldering C. SchmettererH. FlandorferH. Ipser OriginalPaper 08 August 2008 Pages: 10 - 24
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder S.C. YangW.C. ChangC.R. Kao OriginalPaper 10 September 2008 Pages: 25 - 32
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character S. TerashimaT. KohnoK. Tatsumi OriginalPaper 08 October 2008 Pages: 33 - 38
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Dong Hoon KimMoon Gi ChoHyuck Mo Lee OriginalPaper 08 August 2008 Pages: 39 - 45
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate Bo-In NohSeung-Boo Jung OriginalPaper 17 September 2008 Pages: 46 - 53
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate Yoshikazu TakakuKomei MakinoKiyohito Ishida OriginalPaper 22 August 2008 Pages: 54 - 60
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow Chih-hao ChenChi-pu LinChih-ming Chen OriginalPaper 08 October 2008 Pages: 61 - 69
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density Sang-Su HaJong-Woong KimSeung-Boo Jung OriginalPaper 21 October 2008 Pages: 70 - 77
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations Aditya KumarYing YangZhong Chen OriginalPaper 01 November 2008 Pages: 78 - 87
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints R. S. LaiK. L. LinB. Salam OriginalPaper 21 October 2008 Pages: 88 - 92
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates Yee-Wen YenWei-Kai LiouChiapyng Lee OriginalPaper 21 October 2008 Pages: 93 - 99
Thermal Stability Study of Cu(MoN x ) Seed Layer on Barrierless Si J.P. ChuC.H. LinV.S. John OriginalPaper 29 July 2008 Pages: 100 - 107
Reflectivity and Abnormal Absorption at ITO/Al Interface Y.H. LinC.Y. Liu OriginalPaper 21 October 2008 Pages: 108 - 112
Phase Transitions in the BiVO4-nPbO (n = 1, 2) System: Structural–Electrical Properties Relationships Jean-Pierre WignacourtMichel DrachePascal Roussel OriginalPaper 06 November 2008 Pages: 113 - 118
Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy W. WangW. BowenJ. Phillips OriginalPaper 21 October 2008 Pages: 119 - 125
Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe Derek S. BaleCsaba Szeles OriginalPaper 10 October 2008 Pages: 126 - 144
Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process Chung-Chieh YangChia-Feng LinChung-Ying Chang OriginalPaper 30 October 2008 Pages: 145 - 152
Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted Al x Ga1−x N with High Aluminum Mole Fraction E.A. MooreY.K. YeoR.L. Hengehold OriginalPaper 08 October 2008 Pages: 153 - 158
A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst Akihisa KubotaKeita YagiKazuto Yamauchi OriginalPaper 16 October 2008 Pages: 159 - 163
Ceramic Substrates for High-temperature Electronic Integration N. ChasserioS. Guillemet-FritschS. Dagdag OriginalPaper 07 October 2008 Pages: 164 - 174
Factors That Govern the Performance of Thermal Interface Materials Parisa Pour Shahid Saeed AbadiChia-Ken LeongD.D.L. Chung OriginalPaper 10 October 2008 Pages: 175 - 192
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source Chih-ming ChenPo-yuan ShihYi-wei Lin OriginalPaper 09 October 2008 Pages: 193 - 199
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu Li-ling YanCheng-kuo LeeSeung-Uk Yoon OriginalPaper 16 October 2008 Pages: 200 - 207
Simulation, Modeling, and Crystal Growth of Cd0.9Zn0.1Te for Nuclear Spectrometers Krishna C. MandalSung Hoon KangJoseph A. Williams Erratum 07 October 2008 Pages: 208 - 208