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The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder

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Abstract

The microstructure and joint properties of Au stud bumps joined with Sn-3.5Ag solder were investigated as functions of flip chip bonding temperature and aging time. Au stud bumps were bonded on solder-onpad (SOP) at bonding temperature of 260°C and 300°C for 10 s, respectively. Aging treatment was carried out at 150°C for 100 h, 300 h, and 500 h, respectively. After flip chip bonding, intermetallic compounds (IMCs) of AuSn, AuSn2, and AuSn4 were formed at the interface between the Au stud bump and Sn-3.5Ag solder. At a bonding temperature of 300°C, AuSn2 IMC clusters, which were surrounded by AuSn4 IMCs, were observed in the Sn-3.5Ag solder bump. After flip chip bonding, bonding strength was approximately 220.5mN/bump. As aging time increased, the bonding strength decreased. After 100 h of aging treatment, the bonding strength of the joint bonded at 300°C was lower than that bonded at 260°C due to the fast growth rate of the AuSn2 IMCs. The main failure modes were interface fractures between the AuSn2 IMCs and AuSn4 IMCs, fractures through the AuSn2 IMCs and pad lift. Initial joint microstructures after flip chip bonding strongly affected the bonding strengths of aged samples.

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Authors and Affiliations

  1. Dept. of Electronic Packaging Engineering, University of Science & Technology, Daejeon, 305-350, Korea

    Young-Kyu Lee

  2. Micro-Joining Center, Korea Institute of Industrial Technology, Incheon, 406-840, Korea

    Young-Kyu Lee, Yong-Ho Ko, Jun-Ki Kim, Chang-Woo Lee & Sehoon Yoo

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  1. Young-Kyu Lee
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  2. Yong-Ho Ko
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  3. Jun-Ki Kim
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  4. Chang-Woo Lee
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  5. Sehoon Yoo
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Correspondence to Sehoon Yoo.

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Lee, YK., Ko, YH., Kim, JK. et al. The effect of intermetallic compound evolution on the fracture behavior of Au stud bumps joined with Sn-3.5Ag solder. Electron. Mater. Lett. 9, 31–39 (2013). https://doi.org/10.1007/s13391-012-2128-5

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  • DOI: https://doi.org/10.1007/s13391-012-2128-5

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