Electronic Materials Letters
The journal Electronic Materials Letters publishes original papers and occasional critical reviews on all aspects of research and technology in electronic materials. Topics include electronic, magnetic, photonic, and nanoscale materials. The editors place emphasis on science, technology and applications of materials, especially on the relationships among the processing and structure of various materials and their mechanical, thermal, chemical, electrical, electronic, electrochemical, magnetic and optical properties. Coverage of processing includes thin film, nanostructure fabrication self-assembly, solidification, phase transformation, and bulk, as well as related topics in thermodynamics, kinetics and modeling.
Electronic Materials Letters is an official journal of the Korean Institute of Metals and Materials.
Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding
- Journal Title
- Electronic Materials Letters
- Volume 5 / 2009 - Volume 13 / 2017
- Print ISSN
- Online ISSN
- The Korean Institute of Metals and Materials
- Additional Links
- Industry Sectors
To view the rest of this content please follow the download PDF link above.