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Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples

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Abstract

Solidification and interfacial reactions in Sn-57 wt.%Bi-(Co)/Cu couples are investigated. The addition of 0.05 wt.% Co and 0.5 wt.% Co and changes between 2 g and 20 mg solder sizes have no significant effects on the undercooling of Sn-57 wt.%Bi solders. Both η-Cu6Sn5 and ε-Cu3Sn phases are formed in Sn-57 wt.%Bi/Cu couples reacted at 80°C, 100°C, and 100°C, whereas only η-Cu6Sn5 is formed at 160°C. The formation of ε-Cu3Sn is suppressed and only η-Cu6Sn5 is found in the couple with 0.05 wt.% Co and 0.5 wt.% Co addition in Sn-57 wt.%Bi solder. Both the growth rate of η-Cu6Sn5 and the dissolution rate of the Cu substrate increase with Co addition. The morphology of η-Cu6Sn5 is also altered with Co addition, becoming a porous structure with solder trapped in the voids.

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Authors and Affiliations

  1. Department of Chemical Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu, 300, Taiwan

    Yu-chih Huang & Sinn-wen Chen

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  1. Yu-chih Huang
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  2. Sinn-wen Chen
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Correspondence to Sinn-wen Chen.

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Huang, Yc., Chen, Sw. Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 wt.%Bi-(Co)/Cu Couples. J. Electron. Mater. 40, 62–70 (2011). https://doi.org/10.1007/s11664-010-1386-y

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  • DOI: https://doi.org/10.1007/s11664-010-1386-y

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