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Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders

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Lead-free silver nanoparticle pastes have been tested as a replacement for high temperature lead-rich solders used in electronic manufacturing. The pastes contain a small amount of solvent, and primarily consist of submicron-silver powder and passivated silver nanoparticles. The nanoparticles were synthesized from Ag2CO3 and a long-chain alcohol by a method that produced a passivating layer consisting almost exclusively of the carboxylate of the reactant alcohol. The pastes were used to connect a silicon diode chip to copper bases without applied pressure when sintered at 350°C under nitrogen. Diode packages made with sintered silver interconnects had electrical and thermal properties equal to those with lead-soldered interconnects, even after 3000 thermal cycles between −55°C and +150°C. The mechanical strength was half that of lead-rich solder joints, but still strong enough for practical use.

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Acknowledgements

This work was supported by KAKENHI 19540343. Part of this work was conducted in Kyoto-Advanced Nanotechnology Network, supported by “Nanotechnology Network” of the MEXT, Japan.

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Authors and Affiliations

  1. Applied Nanoparticle Laboratory, Incubator, Osaka City University, Osaka, 558-8585, Japan

    Hiroshi Ogura, Minoru Maruyama & Teruo Komatsu

  2. Department of Physics, Osaka City University, Osaka, 558-8585, Japan

    Minoru Maruyama, Teruo Komatsu & Hiroshi Nagasawa

  3. Shindengen Electric Manufacturing Co., Ltd., Hanno, Saitama, 357-8585, Japan

    Ryo Matsubayashi

  4. Institute for Chemical Research, Kyoto University, Uji, Kyoto, 611-0011, Japan

    Tetsuya Ogawa & Seiji Isoda

  5. Bruker AXS K. K., Yokohama, 221-0022, Japan

    Shigeyoshi Nakamura

  6. Department of Chemistry, Osaka City University, Osaka, 558-8585, Japan

    Akio Ichimura

Authors
  1. Hiroshi Ogura
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  2. Minoru Maruyama
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  3. Ryo Matsubayashi
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  4. Tetsuya Ogawa
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  5. Shigeyoshi Nakamura
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  6. Teruo Komatsu
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  7. Hiroshi Nagasawa
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  8. Akio Ichimura
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  9. Seiji Isoda
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Correspondence to Minoru Maruyama.

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Ogura, H., Maruyama, M., Matsubayashi, R. et al. Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders. J. Electron. Mater. 39, 1233–1240 (2010). https://doi.org/10.1007/s11664-010-1236-y

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  • DOI: https://doi.org/10.1007/s11664-010-1236-y

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