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Thermal behavior of silver nanoparticles for low-temperature interconnect applications

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Abstract

Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag particles used (∼20 nm) exhibited obvious sintering behavior at significantly lower temperatures (∼150°C) than the Tm (960°C) of silver. Coalescence of the nano Ag particles was observed by sintering the particles at 150°C, 200°C, and 250°C. The thermal profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the sintering process was observed by thermomechanical analysis (TMA). Sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity. The size of the sintered particles and the crystallite size of the particles increased with increasing sintering temperature.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Georgia Institute of Technology, 30332, Atlanta, GA

    Kyoung-Sik Moon, Hai Dong, Suresh Pothukuchi, Yi Li & C. P. Wong

  2. nGimat Corporation, 30341, Atlanta, GA

    Radenka Maric & Andrew Hunt

Authors
  1. Kyoung-Sik Moon
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  2. Hai Dong
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  3. Radenka Maric
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  4. Suresh Pothukuchi
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  5. Andrew Hunt
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  6. Yi Li
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  7. C. P. Wong
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Moon, KS., Dong, H., Maric, R. et al. Thermal behavior of silver nanoparticles for low-temperature interconnect applications. J. Electron. Mater. 34, 168–175 (2005). https://doi.org/10.1007/s11664-005-0229-8

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  • DOI: https://doi.org/10.1007/s11664-005-0229-8

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