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Silver nanosintering: a lead-free alternative to soldering

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Abstract

We propose a lead-free silver paste as a replacement for a high-temperature lead-rich solder used for electronics. The pastes tested here contain a small amount of solvent, but primarily consist of silver powder and alkoxide-passivated silver nanoparticles that undergo nanosintering when heated. The pastes were used to connect silicon diode chips to copper bases at 350°C in nitrogen ambient without external pressure. The resulting diode packages had electrical and thermal properties about equal to those with lead-solder joints. The mechanical strengths also were comparable to the lead joint. These properties make this nanosilver paste the first viable lead-free alternative to a lead solder.

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Authors and Affiliations

  1. Department of Physics, Osaka City University, Osaka, 558-8585, Japan

    Minoru Maruyama & Teruo Komatsu

  2. Applied Nanoparticle Laboratory Inc., Incubator, Osaka City University, Osaka, 558-8585, Japan

    Minoru Maruyama & Teruo Komatsu

  3. Shindengen Electric Manufacturing Co., Ltd., Hanno, Saitama, 357-8585, Japan

    Ryo Matsubayashi & Hiroaki Iwakuro

  4. Institute for Chemical Research, Kyoto University, Uji, Kyoto, 611-0011, Japan

    Seiji Isoda

Authors
  1. Minoru Maruyama
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  2. Ryo Matsubayashi
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  3. Hiroaki Iwakuro
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  4. Seiji Isoda
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  5. Teruo Komatsu
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Corresponding author

Correspondence to Minoru Maruyama.

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Maruyama, M., Matsubayashi, R., Iwakuro, H. et al. Silver nanosintering: a lead-free alternative to soldering. Appl. Phys. A 93, 467–470 (2008). https://doi.org/10.1007/s00339-008-4807-5

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  • DOI: https://doi.org/10.1007/s00339-008-4807-5

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